Thermoelectric Liquid Cooling for Server Chassis Temperature Control

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Solution Overview

Problem

Conventional temperature control methods for electronic equipment, particularly in edge computing environments, face challenges in providing adequate temperature regulation without increasing chassis size and are inefficient in handling wide external temperature variations.

Innovation Solution

A liquid-assisted and thermoelectric-based temperature control system utilizing a thermoelectric module and a heat exchanger module, with liquid-carrying conduits, that can operate in both cooling and heating modes to manage temperature variations without increasing equipment size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional temperature control components are added to electronic equipment, then temperature control capability is improved, but chassis size must be increased

Engineering Contradiction:

Improvetemperature control capabilityVSAvoidchassis size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent combines the cooling and heating functions into a single integrated temperature control system. The thermoelectric module can operate in both cooling mode (when ambient temperature is high) and heating mode (when ambient temperature is low), eliminating the need for separate cooling and heating components. This merging of functions reduces the overall space required for temperature control components while maintaining effective temperature regulation across wide environmental ranges.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermoelectric module serves multiple functions: it acts as both a cooler and a heater depending on the operating conditions and current direction. The single air channel handles both cooling and heating operations, making the temperature control system universal and adaptable to different ambient temperature conditions without requiring additional specialized components for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If traditional cooling systems are used for edge computing equipment, then cooling capability is provided, but heating capability is insufficient for wide temperature variations

Engineering Contradiction:

Improvetemperature range adaptationVSAvoidtemperature control effectiveness

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The temperature control system dynamically adapts its operation based on ambient temperature conditions. The controller monitors the temperature and automatically switches the thermoelectric module between cooling mode, heating mode, or idle state as needed. This dynamic adjustment allows the system to effectively handle wide temperature variations from -40°C to 70°C without requiring multiple fixed systems, improving both adaptability and control effectiveness.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the operating parameters of the thermoelectric module based on environmental conditions. By reversing the current direction through the thermoelectric module, the system switches between cooling and heating functions. The controller adjusts current magnitude and direction to optimize temperature regulation across different ambient conditions, enabling reliable operation from extreme cold to extreme heat.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively regulates temperature in electronic equipment, adapting to wide environmental ranges and providing flexible temperature control without requiring significant chassis size increases, while optimizing cooling and heating capabilities.

Implementation Method 1

A liquid-assisted and thermoelectric-based temperature control system utilizing a thermoelectric module

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

a heat exchanger module arranged adjacent a rear portion of the electronic equipment chassis

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20250341874A1Liquid-assisted and thermoelectric-based temperature control for servers and other electronic equipment

Publication Date: 2025.11.06 DELL PROD LP

AI summary

An apparatus in one embodiment comprises an electronic equipment chassis having electronic equipment installed therein, a thermoelectric module arranged adjacent a front portion of the electronic equipment chassis, a heat exchanger module arranged adjacent a rear portion of the electronic equipment chassis, and at least first and second liquid-carrying conduits coupled between the thermoelectric module and the heat exchanger module and passing through at least a portion of the electronic equipment chassis. The thermoelectric module, the heat exchanger module and the liquid-carrying conduits are collectively configured to provide temperature control for one or more components of the electronic equipment. The electronic equipment installed in the electronic equipment chassis may comprise at least one server. The thermoelectric module illustratively comprises a thermoelectric cooler, a cold plate coupled to a first side of the thermoelectric cooler, and a heatsink coupled to a second side of the thermoelectric cooler, opposite the first side.