Thermoelectric Cooling for Loopback Modules During High-Power Evaluation
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Solution Overview
Problem
Existing loopback modules suffer from overheating issues due to the use of chip power resistors, leading to power cutoffs during high-power operations, which disrupt evaluation functions.
Innovation Solution
Integration of a thermoelectric cooler with a microcontroller and temperature sensor to dynamically manage temperature by alternating or retaining the cold and hot sides based on temperature thresholds, enabling efficient heat dissipation and power consumption management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a chip power resistor is used as a power consumption component, then the loopback module can evaluate power consumption, but the chip power resistor generates high heating above 100°C when power consumption increases rapidly
Solution Approach 1:
The patent replaces the chip power resistor with a thermoelectric cooler, changing the physical state and operational parameters of the power consumption component. The thermoelectric cooler uses electrical parameters (current direction and magnitude) to control thermal parameters (cooling/heating), allowing dynamic adjustment of temperature based on power consumption levels without exceeding safe temperature thresholds.
Solution Approach 2:
The patent substitutes the passive thermal management of a chip power resistor with an active thermoelectric cooling system. The thermoelectric cooler uses electrical fields to directly pump heat, replacing the reliance on thermal conduction and convection alone, thereby enabling precise temperature control during power consumption evaluation.
2Reliability
If power is cut-off to cool down the chip power resistor, then overheating is prevented, but the loopback module loses the evaluation function of sequential operation
Solution Approach 1:
The patent implements a feedback control system where the microcontroller continuously monitors temperature (or infers it from power consumption) and dynamically adjusts the thermoelectric cooler's operation. When power consumption increases, the system activates the thermoelectric cooler to maintain temperature within safe limits, allowing continuous operation without power cutoff while preventing overheating.
Solution Approach 2:
The patent enables continuous power consumption evaluation by maintaining the thermoelectric cooler in an active state during high-power operations. Unlike the prior art that requires periodic power cutoffs for cooling, the thermoelectric cooler sustains continuous cooling action, ensuring the evaluation function operates uninterrupted even under high power consumption conditions.
3Temperature
If a thermoelectric cooler is used instead of a chip power resistor, then temperature control is improved, but the device complexity increases
Solution Approach 1:
The patent makes the thermoelectric cooler serve multiple functions: it acts as both the power consumption component for evaluation and the temperature control device simultaneously. This multi-functionality reduces the need for separate cooling components, thereby limiting the increase in device complexity despite the advanced temperature control capabilities provided.
Solution Approach 2:
The patent combines the power consumption evaluation function and temperature control function into a single integrated component - the thermoelectric cooler. By merging these two functions that were previously handled by separate components (power resistor for consumption, separate cooling mechanism for temperature), the overall device complexity is minimized while achieving superior temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents power cutoffs by effectively managing heat and power consumption, ensuring continuous operation even under high-power conditions.
Implementation Method 1
The thermoelectric cooler has a first side and a second side located at opposite sides, wherein the first side is in contact with the circuit board and the second side is in contact with the housing. One of the first side and the second side is a cold side and the other one of the first side and the second side is a hot side.
Data Source
AI summary
A loopback module includes a housing, a circuit board and a thermoelectric cooler. The circuit board is disposed in the housing. The circuit board includes a loopback circuit, a microcontroller, a temperature sensor and a thermoelectric cooler driver. The thermoelectric cooler is disposed in the housing. The thermoelectric cooler has a first side and a second side located at opposite sides, wherein the first side is in contact with the circuit board and the second side is in contact with the housing. One of the first side and the second side is a cold side and the other one of the first side and the second side is a hot side.