Thermoelectric Module Manufacturing Apparatus with Vertical Substrate Support
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Solution Overview
Problem
Existing methods for manufacturing thermoelectric modules suffer from structural instability and power instability due to the phase change of brazing filler, leading to weak bonding between thermoelectric elements and electrodes, thermal shock, and high-temperature oxidation, resulting in quality defects and reduced performance.
Innovation Solution
An apparatus is designed with a first block to support a lower substrate and a second block that moves vertically to support an upper substrate, using jigs to position thermoelectric elements between electrodes, and heaters to apply heat to bonding materials, along with a guide structure to stabilize the second block's movement and prevent oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing filler is heated to high temperature for bonding thermoelectric elements to electrodes, then bonding performance is improved, but the brazing filler undergoes phase change from solid to liquid causing thermoelectric element displacement and structural instability
Solution Approach 1:
The patent divides the heating function into separate heating units positioned at different locations (first heating unit for lower bonding, second heating unit for upper bonding). This segmentation allows independent temperature control and heating timing for different bonding zones, preventing simultaneous high-temperature exposure that causes bulk phase change and displacement, while still achieving strong bonding at each interface.
Solution Approach 2:
The patent employs preliminary positioning actions before bonding: the lower substrate is fixed to the lower presser, the thermoelectric element is positioned on the lower electrode, and the upper substrate is fixed to the upper presser. These preliminary actions establish stable positioning before heating begins, preventing displacement even when phase change occurs during bonding.
2Strength
If heat is applied to the substrate or thermoelectric element itself along with the bonded part, then bonding is achieved, but thermal shock causes cracks in the substrate or thermoelectric element reducing power stability
Solution Approach 1:
The patent applies heating locally only to the bonding interfaces between electrodes and thermoelectric elements, rather than heating the entire substrate or thermoelectric element. The first heating unit heats the lower bonding interface, and the second heating unit heats the upper bonding interface. This localized heating achieves bonding strength while avoiding thermal shock to the bulk materials that would cause cracks and reduce power stability.
3Productivity
If thermoelectric element is exposed to high temperature within furnace, then bonding process is completed, but high temperature oxidation reduces power performance and bonding performance
Solution Approach 1:
The patent creates a protected environment for the bonding process by fixing substrates to pressers that can be sealed or controlled. The localized heating approach allows bonding to occur without requiring the entire thermoelectric element to be exposed to high-temperature furnace environments, thereby preventing oxidation of the thermoelectric material while still completing the bonding process through controlled local heating at the interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances structural stability and power stability by ensuring precise positioning and strong bonding of thermoelectric elements to electrodes, minimizing thermal stress and oxidation, thereby improving the overall quality and performance of the thermoelectric module.
Implementation Method 1
a heater that may be configured to apply heat to a bonding material
Implementation Method 2
when the brazing filler used as bonding material goes through a phase change from a solid to a liquid at a temperature equal to or higher than a melting point
Implementation Method 3
a guide structure that may be configured to guide the vertical movement of the second block with respect to the first block
Implementation Method 4
a pressurizing unit that may be configured to apply a pressurizing force to the upper substrate and the lower substrate in a state in which the thermoelectric element is positioned between the upper substrate and the lower substrate
Data Source
AI summary
An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.