Compound Semiconductor Thermoelectric Material with Micrometer Particles

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Solution Overview

Problem

Current compound semiconductor thermoelectric materials face a challenge in achieving high ZT values while maintaining electrical conductivity, as methods to reduce thermal conductivity often result in decreased electrical conductivity, and existing manufacturing processes are costly and not suitable for mass production.

Innovation Solution

A compound semiconductor thermoelectric material is developed with an n-type matrix and n-type particles of 1µm to 100µm size dispersed within, where the particles have electrical conductivity of 10 S/cm or more and similar or lower electron affinity than the matrix, used in conjunction with a Bi-Te system or Bi-Te-Se system, to effectively scatter phonons and improve thermoelectric performance without reducing electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If nm scale fine particles are dispersed in compound semiconductor for phonon scattering, then thermal conductivity is reduced, but electrical conductivity is greatly reduced

Engineering Contradiction:
Improvethermal conductivityVSAvoidelectrical conductivity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent changes the particle size parameter from nanometer scale (nm) to micrometer scale (μm), specifically using particles with 1 μm to 100 μm average diameter. This parameter change allows phonon scattering to reduce thermal conductivity while the larger size prevents excessive scattering of charge carriers, thereby maintaining electrical conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure with n-type particles dispersed in an n-type matrix, where the dispersed particles have different composition from the matrix. This local quality differentiation enables selective phonon scattering at particle-matrix interfaces while maintaining overall electrical conductivity through the n-type matrix pathways

Inventive Principle:
Principle #3Local quality

2Reliability

If nm scale fine particles are dispersed for phonon scattering, then ZT value is improved, but manufacturing cost increases

Engineering Contradiction:
ImproveZT valueVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the particle size from nanometer to micrometer scale, which fundamentally simplifies the manufacturing process. Micrometer-scale particles can be produced through conventional solid-state reactions and simple mixing methods, eliminating the need for expensive nanofabrication techniques, solution processing, or complex dispersion equipment required for nm-scale particles

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses readily available compound semiconductor materials for both the matrix and dispersed particles, avoiding the need for expensive specialized nanomaterials. The micrometer-scale particles can be produced through simple solid-state reactions using conventional powders, making the process economically viable for mass production

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a material with increased ZT values, enabling high-efficiency thermoelectric cooling and power generation without electrical conductivity reduction, and allows for cost-effective mass production through a simple powder-based manufacturing process.

Implementation Method 1

scattering of phonons responsible for thermal conduction is one effective means to reduce thermal conductivity

Methodology Applied
Scientific EffectPhonon scattering:

Implementation Method 2

Thermoelectric power generation is a form of conversion of thermal energy to electrical energy using the Seebeck effect by which a thermoelectromotive force is generated when a temperature difference is formed between both ends of a thermoelectric module

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 3

Thermoelectric cooling is a form of conversion of electrical energy to thermal energy using the Peltier effect which is heat absorption and heat generation occurring between both ends of a thermoelectric module when a direct current flows through the both ends of the thermoelectric module

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentEP3246959B1Compound semiconductor thermoelectric material and method for manufacturing same
Publication Date: 2020.03.04 LG CHEM LTD
  • EP3246959B1 patent drawingFigure 1
  • EP3246959B1 patent drawingFigure 2
  • EP3246959B1 patent drawingFigure 3(a)~3(e)

AI summary

Provided are: a compound semiconductor thermoelectric material, having excellent thermoelectric conversion performance by having an excellent power factor and ZT value, and in particular, having excellent thermoelectric conversion performance at a low temperature; a method for manufacturing the same; and a thermoelectric module, a thermoelectric generator, or a thermoelectric cooling device, etc. using the same. The compound semiconductor thermoelectric material according to the present invention comprises: an n-type compound semiconductor matrix; and n-type particles which are dispersed in the matrix, are compound semiconductors which are different from the matrix, and have an average particle size of 1µm to 100µm.