Thermoelectric Structure Metallization via Additive Manufacturing

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Solution Overview

Problem

Existing thermoelectric module manufacturing processes are complex, limiting geometry and modularity, and result in high contact resistance, which hinders efficient power generation.

Innovation Solution

A method involving additive manufacturing, specifically selective laser sintering or laser powder bed fusion, to integrate metallization during the formation of thermoelectric elements on a metallic layer, followed by substrate removal, simplifying the process and reducing contact resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional direct copper (DBC) technique with brazing and pressing is used for metallization, then electrical connections are established on substrates, but the manufacturing process becomes complex and contact resistance increases

Engineering Contradiction:
Improveelectrical connection qualityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the metallization step with the additive manufacturing process by depositing metallic layers directly onto the thermoelectric elements during printing. This merges two previously separate operations (additive manufacturing and metallization) into one integrated process, eliminating the need for separate DBC substrate attachment and reducing overall process complexity while maintaining electrical connection quality

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metallic layers are deposited onto the thermoelectric elements before final assembly, during the additive manufacturing process itself. This preliminary metallization action allows electrical connections to be established in advance, eliminating the need for subsequent brazing and pressing operations that would otherwise be required to attach copper layers to substrates

Inventive Principle:
Principle #10Preliminary action

2Reliability

If multiple separate manufacturing steps are used for metallization and assembly, then electrical connections are formed, but manufacturing time and costs increase

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges metallization, shaping, and assembly operations into a single additive manufacturing process. The metallic layers are deposited and shaped simultaneously with the thermoelectric elements in one continuous printing operation, eliminating multiple separate manufacturing steps and significantly improving production efficiency while ensuring reliable electrical connections

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The additive manufacturing process operates continuously to deposit metallic layers and form thermoelectric elements without interruption. The laser or deposition source moves continuously across the build platform, maintaining uninterrupted material deposition and bonding, which eliminates idle time between separate manufacturing operations and enhances overall productivity

Inventive Principle:
Principle #20Continuity of useful action

3Ease of manufacture

If conventional metallization methods are used, then electrical connections are established, but contact resistance remains high

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectrical conductivity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces traditional mechanical metallization methods (brazing, pressing, bonding) with an additive manufacturing approach that uses controlled material deposition and in-situ melting. The laser or deposition mechanism directly fuses metallic layers to thermoelectric elements through localized melting and solidification, creating metallurgical bonds with lower contact resistance without requiring high-pressure mechanical assembly

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The additive manufacturing process utilizes precisely controlled thermal parameters (laser power, scanning speed, hatching distance) to optimize the metallization quality. By dynamically adjusting these parameters during printing, the process achieves optimal melting and bonding conditions that minimize contact resistance while maintaining manufacturing simplicity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces manufacturing steps, saves time and costs, and enhances mechanical strength, electrical, and thermal conductivity properties of the resulting thermoelectric structures.

Implementation Method 1

form a thermoelectric element in a thermoelectric material, on the metallic layer, by additive manufacturing, preferably by selective laser sintering (SLS) or laser powder bed fusion (FLLP)

Methodology Applied
Scientific EffectSelective Laser Sintering: Selective Laser Sintering

Implementation Method 2

form a thermoelectric element in a thermoelectric material, on the metallic layer, by additive manufacturing, preferably by selective laser sintering (SLS) or laser powder bed fusion (FLLP)

Methodology Applied
Scientific EffectLaser powder bed fusion: Laser Beam Welding

Data Source

PatentEP4355063B1Method for metallizing a thermoelectric structure
Publication Date: 2026.04.01 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • EP4355063B1 patent drawingFigure 1A~2B
  • EP4355063B1 patent drawingFigure 2C~3C
  • EP4355063B1 patent drawingFigure 3D~4C

AI summary

A method for manufacturing a thermoelectric structure comprising the following steps: a) providing a substrate (100), covered by a metallic layer (300), b) forming a thermoelectric element (200), on the metallic layer (300), by additive manufacturing, preferably by SLS or FLLP, thereby obtaining a thermoelectric structure comprising the substrate (100) covered successively by the metallic layer (300) and by the thermoelectric element (200), and c) optionally removing the substrate (100), thereby obtaining a thermoelectric structure comprising the metallic layer (300) and the thermoelectric element (200).