Thermoelectric Micro-Platform for Precise Thermal Management
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Solution Overview
Problem
Current cooling and temperature sensing technologies for small regions, such as integrated circuits and sensors, face challenges in efficiently managing heat dissipation and temperature control due to limitations in passive and active cooling techniques, which often require significant power consumption or are inadequate for precise thermal management.
Innovation Solution
A thermoelectric micro-platform with micron-sized dimensions, featuring a support layer with low thermal conductivity and a device layer with high thermal conductivity, incorporating series-connected thermoelectric structures that operate in Seebeck thermovoltaic mode for temperature sensing and Peltier cooling mode for cooling, along with nano-wires that minimize heat conduction through phonon scattering, enabling efficient temperature control and sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If passive cooling techniques (heat sink, natural convection) are used, then power consumption is zero, but cooling effectiveness is insufficient for high heat dissipation requirements
Solution Approach 1:
The patent transitions from passive cooling to active thermoelectric cooling by changing the operational parameters from zero power consumption to controlled power input, enabling effective heat dissipation for high-performance processors that passive methods cannot handle
Solution Approach 2:
The patent replaces mechanical cooling systems (fans, heat pipes) with solid-state thermoelectric devices, eliminating moving parts while providing active cooling control through electrical current
2Reliability
If active cooling techniques (fans, heat pipe, liquid cooling) are used, then cooling effectiveness is improved, but power consumption increases significantly
Solution Approach 1:
The patent replaces mechanical cooling systems (fans, pumps, moving parts) with solid-state thermoelectric devices, eliminating mechanical complexity while providing efficient active cooling with lower power consumption
Solution Approach 2:
The patent optimizes power consumption by using thermoelectric devices that provide precise cooling control, allowing the system to achieve effective cooling only when and where needed, rather than continuous high-power mechanical cooling
3Reliability
If conventional cooling packages are used, then heat dissipation is managed, but temperature control precision is insufficient for sensor-specific requirements
Solution Approach 1:
The patent divides the cooling function into multiple independent thermoelectric devices that can be individually controlled, allowing precise temperature management of specific sensor regions rather than uniform cooling of the entire package
Solution Approach 2:
The patent applies cooling selectively to specific regions requiring temperature control by positioning thermoelectric devices locally at sensor elements, providing tailored temperature management for different functional areas
4Reliability
If thermoelectric devices are used for cooling, then active cooling with good temperature control is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple thermoelectric devices into a single integrated cooling package that functions as one unified component, simplifying assembly and reducing the number of separate parts while maintaining effective temperature control
Solution Approach 2:
The patent designs the thermoelectric cooling package to serve multiple functions including cooling, temperature sensing, and potential heating, reducing the need for separate components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermoelectric micro-platform effectively reduces electrical thermal noise, provides dynamic temperature control, and enables precise temperature management for applications like hygrometers and gas flow sensors, achieving efficient heat dissipation and accurate temperature sensing with minimal power consumption.
Implementation Method 1
a first portion of the thermoelectric structures are operated in a Seebeck thermovoltaic mode for temperature sensing
Implementation Method 2
a second portion of the thermoelectric structures are operated in a Peltier cooling mode for cooling
Implementation Method 3
nano-wires that minimize heat conduction through phonon scattering
Data Source
AI summary
A thermoelectric micro-platform includes a suspended micro-platform, the suspended micro-platform being configured as a support layer with a device layer disposed thereon. Two arrays of series-connected thermoelectric devices are disposed partially on the micro-platform. One array is operated as Peltier coolers and the other array is operated as Seebeck sensors.