Thermoelectric module and refrigerator comprising same
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Solution Overview
Problem
Existing thermoelectric modules in refrigerators face limitations in achieving ultra-low temperatures due to inefficient heat transfer and increased resistance, leading to decreased cooling capacity and efficiency when attempting to cool deep freezing compartments below −20°C.
Innovation Solution
A thermoelectric module design incorporating a cold sink, heat sink, and thermoelectric element integrated by a sealing cover, with a cascade type configuration and use of a heat dissipation sheet, reduces thickness and improves heat transfer, using a gold plating layer for improved soldering stability and eliminating ceramic substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If supply current is increased to lower the temperature of the heat absorption surface, then the temperature difference between heat absorption surface and heat generation surface increases, but the cooling capacity decreases due to increased resistance and self-heat generation
Solution Approach 1:
The patent introduces a heat dissipation sheet as an intermediary component between the heat generation surface of the thermoelectric element and the heat sink. This heat dissipation sheet efficiently conducts heat away from the heat generation surface, reducing thermal resistance and preventing heat backflow to the heat absorption surface, thereby maintaining cooling capacity at higher current levels
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing a heat dissipation sheet with high thermal conductivity material. This parameter change allows for more efficient heat transfer from the heat generation surface, enabling the system to operate at higher currents without losing cooling capacity
2Temperature
If supply current is increased to achieve lower temperatures, then temperature difference increases, but efficiency of the thermoelectric module deteriorates
Solution Approach 1:
The heat dissipation sheet acts as a mediator that improves heat transfer efficiency from the heat generation surface to the heat sink. This reduces the energy wasted as self-heat and minimizes heat backflow, thereby maintaining higher efficiency even at increased supply current levels
Solution Approach 2:
The patent replaces the conventional air-cooling mechanism with a solid-state heat dissipation sheet that provides more efficient thermal conduction. This substitution eliminates the limitations of air cooling and enables better thermal management with improved energy efficiency
3Device complexity
If heat generation surface is cooled by indoor air, then the structure is simple, but the temperature of the heat generation surface cannot be lower than room temperature
Solution Approach 1:
The heat dissipation sheet serves as a thermal intermediary that couples the heat generation surface to an external cooling system. This allows the heat generation surface temperature to be decoupled from ambient air temperature, enabling sub-ambient cooling while maintaining structural simplicity
Solution Approach 2:
The patent extracts the heat dissipation function from the ambient air cooling system and implements it through a dedicated heat dissipation sheet component. This extraction allows for controlled heat removal independent of ambient conditions, enabling the heat generation surface to operate below room temperature
4Temperature
If heat is transferred from cold sink to heat sink, then cooling function is achieved, but heat flows back toward heat absorption surface when heat generation surface is not sufficiently cooled
Solution Approach 1:
The heat dissipation sheet is positioned as a thermal intermediary between the heat generation surface and the heat sink, creating a dedicated heat egress path. This intermediary structure prevents heat backflow to the heat absorption surface by providing a low-resistance thermal pathway that continuously conducts heat away from the heat generation surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves ultra-low temperatures of about −50°C in deep freezing compartments with enhanced heat transfer, reduced module thickness, improved soldering stability, and simplified manufacturing, while maintaining efficiency and cooling capacity.
Implementation Method 1
a thermoelectric element (40) having a heat absorption surface coupled to the cold sink (22)... heat transferred from the cold sink (22) to the outside of the thermoelectric element
Implementation Method 2
a heat sink (24) coupled to a heat generation surface of the thermoelectric element to dissipate heat transferred from the cold sink (22) to the outside of the thermoelectric element
Data Source
AI summary
A thermoelectric module according to an embodiment of the present invention may comprise: a cold sink; a thermoelectric element having a heat absorption surface coupled to the cold sink; a heat sink coupled to a heating surface of the thermoelectric element to dissipate heat transferred from the cold sink to the outside of the thermoelectric element; and a sealing cover for connecting the edge of the cold sink and the edge of the heat sink to surround the thermoelectric element, wherein the cold sink, the heat sink, and the thermoelectric element may be integrally formed by the sealing cover.In addition, the thermoelectric element may be a cascade type thermoelectric element in which two thermoelectric elements having the same or different specifications are coupled to each other.