Thermoelectric Module With Compressible Heat-Conducting Layer

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Solution Overview

Problem

Thermoelectric modules face challenges in compensating for different thermal expansions and maintaining operational integrity under varying thermal loads, which can lead to stress and functional failures due to high tolerance requirements and the need for precise component alignment and bonding.

Innovation Solution

A thermoelectric module with a compressible heat conducting layer is implemented between the thermoelectric elements and the hot or cold sides, allowing for thermal expansion compensation and reducing manufacturing tolerance demands, while also providing electrical insulation and thermal conductivity, and can be used in both tubular and plate-shaped configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If housing walls and supporting tubes are used to bound the thermoelectric module, then structural support is provided, but high tolerance requirements and thermal expansion stresses are introduced

Engineering Contradiction:

Improvestructural supportVSAvoidtolerance requirements

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent replaces rigid housing walls and supporting tubes with a flexible membrane that bounds the thermoelectric elements. This membrane can deform to accommodate thermal expansion and contraction, eliminating the high tolerance requirements and stress concentration problems associated with rigid structural supports while maintaining the necessary containment and support functions.

Inventive Principle:

Principle #30Flexible shells and thin films

2Stability of the object's composition

If rigid housing walls are used to bound thermoelectric elements, then structural integrity is maintained, but thermal expansion stresses are introduced into the thermoelectric material

Engineering Contradiction:

Improvestructural integrityVSAvoidthermal expansion stresses

Core Design Contradiction:

Stability of the object's compositionVSStress or pressure

Solution Approach 1:

The flexible membrane provides structural integrity while allowing for thermal deformation. The membrane's flexibility enables it to expand and contract with temperature changes without transmitting high stresses to the thermoelectric material, thus maintaining structural integrity while accommodating thermal expansion.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the mechanical parameter of the bounding structure from rigid to flexible. This parameter change allows the housing to adapt its stiffness characteristics, providing structural support when needed while allowing thermal deformation to occur without stress concentration, thereby protecting the thermoelectric material from thermal expansion stresses.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If precise component alignment and bonding are required, then operational capability is ensured, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveoperational capabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The flexible membrane simplifies the assembly process by eliminating the need for precise alignment and bonding of rigid housing components. The membrane can be easily fitted and sealed around the thermoelectric elements without requiring complex bonding procedures, thereby reducing manufacturing complexity while ensuring operational capability through proper sealing and electrical insulation.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compressible heat conducting layer absorbs thermal stresses, compensates for component expansions, and reduces manufacturing costs by allowing larger component tolerances, enabling a thermoelectric module that is resistant to long-term thermal loads without the need for complex structural measures or bonded connections.

Implementation Method 1

a heat conducting layer which is implemented so as to be compressible... The compressible heat conducting layer absorbs thermal stresses, compensates for component expansions

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Thermoelectric materials are of such a type that they can effectively convert thermal energy into electrical energy (Seebeck effect)

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 3

Thermoelectric materials are of such a type that they can effectively convert thermal energy into electrical energy (Seebeck effect) and vice-versa (Peltier effect)

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS9331257B2Thermoelectric module with a heat conducting layer and method of manufacturing a thermoelectric module

Publication Date: 2016.05.03 EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH

AI summary

A thermoelectric module includes a cold side, a hot side and thermoelectric elements disposed between the two sides. At least one heat conducting layer is disposed between the thermoelectric elements and at least the cold side or the hot side and the heat conducting layer can be compressed. A method for producing a thermoelectric module having at least one heat conducting layer is also provided.