Thermoelectric Module Coupling Design for Stable Refrigerator Assembly

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Solution Overview

Problem

Existing refrigerators with thermoelectric modules face challenges in stable and firm coupling to the main body, efficiency of cooling, and ease of assembly and separation.

Innovation Solution

A refrigerator design that includes a thermoelectric module with a module plate supporting a heat dissipation sink and a cooling sink, coupled to the main body via a coupling member penetrating the module plate, and a connecting frame for stable attachment, enhancing thermal contact and ease of assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thermoelectric module is installed in a refrigerator main body, then cooling function is provided, but stable and firm coupling to the main body is difficult to achieve

Engineering Contradiction:
Improvecoupling stabilityVSAvoidcoupling structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The coupling structure is divided into multiple independent components: a coupling protrusion on the thermoelectric module, a coupling groove on the main body, and a separate coupling member (screw or rivet). This segmentation allows each component to perform its specific function while simplifying the overall assembly and disassembly process, directly addressing the contradiction between coupling stability and device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coupling protrusion and coupling groove are pre-formed during manufacturing, allowing the thermoelectric module to be quickly and accurately positioned on the main body without requiring complex alignment procedures during installation. This preliminary preparation ensures stable coupling while minimizing assembly complexity.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If a thermoelectric module is installed in a refrigerator main body, then cooling function is provided, but ease of assembly and separation is reduced

Engineering Contradiction:
Improveassembly easeVSAvoidcoupling firmness
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The coupling structure uses separable components (protrusion, groove, and coupling member) that can be easily assembled and disassembled. The thermoelectric module can be quickly attached to or removed from the main body by simply engaging the protrusion with the groove and securing it with a coupling member, maintaining both ease of operation and coupling firmness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coupling structure transitions from a fixed, permanent attachment to a dynamic, reversible connection. The use of removable coupling members (screws or rivets) allows the assembly to be easily disassembled and reassembled multiple times without compromising the firmness of the connection when assembled, directly resolving the contradiction between ease of assembly and coupling reliability.

Inventive Principle:
Principle #15Dynamics

3Productivity

If thermal contact between thermoelectric element and sinks is enhanced, then cooling efficiency is improved, but device complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidthermal contact structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The heat dissipation sink and cooling sink are integrated with the thermoelectric element through direct contact surfaces and thermal conductive materials, merging the thermal management function into a compact, unified structure. This integration enhances cooling efficiency by maximizing thermal contact area while avoiding the need for separate, complex thermal management subsystems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The thermal contact between the thermoelectric element and sinks is optimized by changing physical parameters such as contact pressure, contact area, and thermal conductivity of interface materials. These parameter adjustments improve heat transfer efficiency without requiring additional complex structures, directly addressing the contradiction between cooling efficiency and device complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves stable and firm coupling of the thermoelectric module to the main body, improves cooling efficiency through enhanced thermal contact, and facilitates easy assembly and separation.

Implementation Method 1

a thermoelectric module that causes heating and cooling actions through the Peltier effect of a thermoelectric element

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

a heat dissipation sink that is in contact with the heating part

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Implementation Method 3

a cooling sink that is in contact with the heat absorbing part

Methodology Applied
Scientific EffectHeat absorption: Heat Exchanger

Data Source

PatentUS20250224156A1refrigerator
Publication Date: 2025.07.10 SAMSUNG ELECTRONICS CO LTD
  • US20250224156A1 patent drawing
  • US20250224156A1 patent drawing
  • US20250224156A1 patent drawing

AI summary

A refrigerator including a main body; a storage room inside the main body; a thermoelectric module including a module plate including an element mounting portion, a heat dissipation sink on a first side of the module plate, a cooling sink on a second side of the module plate, and a thermoelectric element positioned in the element mounting portion such that a first surface of the thermoelectric element contacts the heat dissipation sink and a second surface of the thermoelectric element contacts the cooling sink; and a coupling member penetrating the module plate of the thermoelectric module to couple the thermoelectric module to an upper surface of the main body.