Thermoelectric Module With Embedded Thermistor for Reduced Thickness
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Solution Overview
Problem
Existing thermoelectric conversion modules face challenges in achieving high integration and reduced thickness due to the presence of temperature sensors and current-carrying electrodes occupying significant area, as they are typically mounted on the heat absorption and dissipation sides.
Innovation Solution
The thermistor for temperature detection is embedded inside the substrate of the thermoelectric conversion module, with current-carrying electrodes located on the substrate surfaces, eliminating the need for mounting on the heat absorption and dissipation sides and reducing wiring lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are installed on substrates included in the module, then temperature detection function is achieved, but the temperature sensors, current-carrying electrodes, and the like occupy a large area which hinders high integration of thermoelectric elements
Solution Approach 1:
The patent merges the temperature sensor and current-carrying electrode functions into a single integrated component structure. The temperature sensor is positioned to share the same mounting area as the current-carrying electrodes, reducing the total area occupied by these components while maintaining both temperature detection and electrical connection functions.
Solution Approach 2:
The patent utilizes the thickness dimension by embedding the temperature sensor within or near the substrate layers, rather than only using the planar surface area. This three-dimensional arrangement allows temperature detection functionality to be achieved with minimal impact on the planar integration density of thermoelectric elements.
2Measurement precision
If temperature sensors are mounted on heat absorption and dissipation sides, then temperature monitoring is achieved, but the module thickness increases and integration is hindered
Solution Approach 1:
The temperature sensor is nested within the existing substrate and electrode structure of the thermoelectric module. Rather than adding a separate mounting layer that increases thickness, the sensor is integrated into the existing hierarchical structure of the module, allowing temperature monitoring without proportionally increasing the overall module thickness.
3Device complexity
If thermistor is embedded inside substrate, then high integration and reduced thickness are achieved, but manufacturing complexity increases
Solution Approach 1:
The thermistor embedding process is performed as a preliminary step during substrate preparation, before the final assembly of the thermoelectric module. By incorporating the thermistor into the substrate during earlier manufacturing stages, the overall manufacturing complexity is reduced compared to post-assembly integration methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a highly integrated and thinner thermoelectric conversion module with improved temperature sensitivity and reduced electrode area, enabling efficient heat absorption and generation.
Implementation Method 1
a device that directly inter-converts thermal energy and electrical energy using a thermoelectric conversion module having a thermoelectric effect such as a Seebeck effect or a Peltier effect
Implementation Method 2
a device that directly inter-converts thermal energy and electrical energy using a thermoelectric conversion module having a thermoelectric effect such as a Seebeck effect or a Peltier effect
Implementation Method 3
a thermistor for temperature detection embedded inside the first substrate and/or the second substrate
Data Source
AI summary
Provided are a thinner thermoelectric conversion module in which a thermistor for temperature detection is embedded inside a substrate included in the thermoelectric conversion module, and a method for manufacturing the thermoelectric conversion module. The thermoelectric conversion module includes a first substrate having a first principal surface and a second principal surface opposite to the first principal surface, a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface, a first electrode provided on the second principal surface, a second electrode provided on the third principal surface, a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface, and a thermistor for temperature detection embedded inside the first substrate and/or the second substrate, and current-carrying electrodes that energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface.