Thermoelectric Module Fluid Channels for High-COP Heating and Cooling
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Solution Overview
Problem
Existing thermal management systems in vehicles and energy storage systems face limitations in achieving high coefficients of performance (COP) for heating and cooling, particularly at low ambient temperatures and in scenarios where high heating capacity is required.
Innovation Solution
The use of a device comprising multiple thermoelectric modules arranged in a planar or three-dimensional grid, with fluid channels on both sides of the modules, and barriers that enhance heat transfer, allowing for efficient heat exchange and operation at or near the optimum COP range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat pumps are used for heating at low ambient temperatures, then heating capacity is required, but the COP approaches unity and mass flow rate is limited due to low refrigerant density
Solution Approach 1:
The patent changes the working fluid from conventional refrigerant to liquid metal (such as gallium, indium, or their alloys), fundamentally altering the physical parameters including density, thermal conductivity, and specific heat capacity. This parameter change enables the system to maintain high COP at low ambient temperatures where conventional heat pumps fail, as liquid metals retain high density and thermal conductivity even at sub-zero temperatures.
Solution Approach 2:
The patent replaces the mechanical compression system (compressor, condenser, evaporator) with a thermoelectric module that uses electrical current to directly pump heat. This substitution eliminates the refrigerant cycle mechanical system and leverages the Peltier effect in thermoelectric materials to achieve heating/cooling with high efficiency at low temperatures without being constrained by refrigerant density.
2Ease of operation
If electric heating is used, then responsive control is achieved, but the COP is limited to one
Solution Approach 1:
The patent replaces resistive heating (I²R heating) with thermoelectric heating based on the Peltier effect. While both methods offer responsive control through electrical input, the thermoelectric method achieves COP greater than one by simultaneously transferring heat from a cold side while generating heat on the hot side, whereas resistive heating only generates heat with COP=1.
3Use of energy by moving object
If passive cooling methods are used, then low driving power is required, but the cooling temperature is limited by the temperature difference between the component and cooling medium
Solution Approach 1:
The patent replaces passive convection cooling with active thermoelectric cooling using the Peltier effect. This substitution enables the system to actively pump heat from the cooled component to a heat sink, achieving cooling temperatures below the ambient cooling medium temperature, while maintaining relatively low power consumption compared to conventional active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a high COP for heating and cooling, exceeding that of conventional electric heaters and heat pumps, especially at low ambient conditions, while reducing energy consumption and providing effective temperature control.
Implementation Method 1
a thermoelectric module between the first and second fluid channels, the thermoelectric module thermally coupled to each of the first and second fluid channels
Data Source
AI summary
A device comprises: a first fluid channel for a first fluid, the first fluid channel including first barriers; a second fluid channel for a second fluid, the second fluid channel including second barriers; and a thermoelectric module between the first and second fluid channels, the thermoelectric module thermally coupled to each of the first and second fluid channels.