Thermoelectric Module Insulating Member Heat Leakage
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Solution Overview
Problem
Existing thermoelectric modules face challenges in maintaining uniformity and efficiency due to material losses during the cutting process, especially when applied to slim structures, and suffer from reduced cooling ability and leakage currents due to heat transfer and connection issues.
Innovation Solution
A thermoelectric module is designed with insulating members having low heat conductivity, such as epoxy resin or SiO-based materials, applied to the external surfaces of semiconductor elements to control heat transfer and prevent leakage currents, while varying substrate volumes and shapes enhance thermoelectric efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermoelectric elements are manufactured as bulk type with uniform size, then manufacturing uniformity is improved, but material loss increases during cutting process
Solution Approach 1:
The patent divides the thermoelectric element into multiple segments by forming recesses on opposite side surfaces, creating multiple active regions separated by insulation portions. This segmentation allows the element to be cut into smaller pieces with reduced material loss while maintaining uniformity of each segment's functional dimensions.
Solution Approach 2:
The patent applies different properties to different parts of the thermoelectric element: the active regions maintain high thermoelectric performance while the recesses and insulation portions provide electrical isolation and structural differentiation. This local quality approach allows optimized cutting patterns that preserve uniformity in critical areas while minimizing overall material waste.
2Adaptability or versatility
If thermoelectric element thickness is reduced for slim structure, then adaptability to slim products is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent transitions from controlling thickness alone to utilizing the planar dimension by forming recesses on side surfaces. This dimensional shift allows the element to achieve slim profile through lateral material removal rather than reducing thickness, making manufacturing more feasible while maintaining adaptability to slim products.
Solution Approach 2:
The patent creates nested structures by forming recesses within the element body and placing insulation portions within these recesses. This nesting approach allows the element to maintain a compact, slim external dimension while incorporating functional features that facilitate manufacturing and improve performance.
3Reliability
If thermoelectric element is connected between substrates, then electrical connection is achieved, but heat transfer from heating part to cooling part reduces cooling ability
Solution Approach 1:
The patent extracts the harmful heat transfer path by removing material to form recesses between the heating and cooling sides. These recesses, filled with insulation material, separate the thermal pathways, preventing direct heat conduction from the heating part to the cooling part through the element body, thereby preserving cooling ability while maintaining electrical connection.
Solution Approach 2:
The patent introduces insulation portions as intermediary materials within the recesses. These intermediaries provide electrical connection pathways while blocking direct thermal conduction, effectively mediating between the requirement for electrical connectivity and the need to prevent harmful heat transfer.
4Reliability
If connection material is used to connect thermoelectric elements to substrates, then electrical connection is achieved, but leakage current is generated reducing thermoelectric efficiency
Solution Approach 1:
The patent extracts the source of leakage current by removing connection material from the vicinity of the thermoelectric element through the formation of recesses. By positioning insulation portions within these recesses, the design eliminates the direct contact between conductive connection material and the element surfaces where leakage would occur, while maintaining necessary electrical connections through controlled pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves thermoelectric performance by reducing material losses, enhancing cooling efficiency, and preventing electrical leakage, achieving a 5-10% increase in thermoelectric performance and enabling the application of thermoelectric elements in slim structures.
Implementation Method 1
an insulating member disposed on an external surface of the first semiconductor element and the second semiconductor element and having a lower heat conductivity than that of the first semiconductor element and the second semiconductor element
Implementation Method 2
a first semiconductor element and a second semiconductor element arranged between the first substrate and the second substrate
Data Source
Figure 1
Figure 2~3(b)
Figure 4~5(b)
AI summary
Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.