Thermoelectric conversion module
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Solution Overview
Problem
Thermoelectric conversion modules face reduced rigidity when substrates are divided, leading to inefficiencies in heat transfer due to unintended stress and loosened connections from thermal expansion, particularly in uni-leg configurations.
Innovation Solution
A thermoelectric conversion module design with multiple substrates and inter-substrate connectors that increase rigidity by connecting electrodes across multiple sides, improving thermal expansion accommodation and density of thermoelectric elements per unit area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is divided into multiple parts to accommodate thermal expansion, then the ability to handle thermal expansion is improved, but the rigidity of the thermoelectric conversion module is reduced
Solution Approach 1:
The substrate is divided into multiple separate substrates (first substrate and second substrate) that can independently expand and contract with thermal changes. This segmentation allows each substrate to accommodate thermal expansion without restraining the others, solving the contradiction between adaptability to thermal expansion and structural rigidity.
Solution Approach 2:
The connector serves as an intermediary element that electrically connects electrodes between substrates while allowing thermal expansion. The connector is positioned to enable relative movement between substrates during thermal expansion, maintaining electrical connectivity without transmitting mechanical stress that would reduce rigidity.
2Quantity of substance
If the substrate is divided into multiple parts, then the density of thermoelectric elements per unit area is improved, but the rigidity is reduced particularly in uni-leg configurations
Solution Approach 1:
Dividing the substrate into multiple substrates enables higher density of thermoelectric elements by allowing independent optimization of each substrate's element arrangement. The segmented structure accommodates the increased element density while maintaining overall module rigidity through the connector-based electrical connections that don't compromise structural strength.
3Ease of manufacture
If a single bond connects adjacent substrates, then the manufacturing complexity is reduced, but the rigidity becomes insufficient particularly in uni-leg configurations
Solution Approach 1:
The connector acts as an intermediary that provides robust mechanical and electrical connection between substrates. By positioning the connector to span between substrates and connect electrodes, it creates a rigid structural linkage that maintains module rigidity while preserving manufacturing simplicity through a straightforward connection mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the durability and efficiency of the thermoelectric conversion module by maintaining rigidity and improving output per unit area while accommodating thermal expansion, compared to single-substrate configurations.
Implementation Method 1
a thermoelectric conversion module that uses the Seebeck effect to generate electricity
Implementation Method 2
the Peltier effect to carry out cooling and heating
Implementation Method 3
Thermoelectric conversion elements expand with heat
Data Source
Figure 1
Figure 2~4
Figure 5~6
AI summary
[Problem] To provide a thermoelectric conversion module wherein a decrease in rigidity is suppressed even if a base part is divided into a plurality. [Solution] The thermoelectric conversion module 1 comprises a plurality of low temperature side base parts 6, a plurality of first electrodes 3, a plurality of thermoelectric conversion elements 2, a plurality of second electrodes 4, X-axis connecting portions 7, and Y-axis connecting portions 8. Each of the low temperature side base parts 6 has six of the second electrodes 4 disposed thereon. Between adjacent low temperature side base parts 6, two X-axis connecting portions 7 or Y-axis connecting portions 8a, 8b are disposed as base part interconnecting portions. One set of the plurality of base part interconnecting portions are for establishing connection from one set of the first electrodes 3 located above one set of the low temperature side base parts 6 to another set of second electrodes 4 located above another set of low temperature side base parts 6. Another set of base part interconnecting portions establish connection from said another set of first electrodes 3 located above said another low temperature side base parts 6 to said one set of the second electrodes 4 located above said one set of the low temperature side base parts 6.