Thermoelectric Module Lead Structure for Heat and Detachment Control
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Solution Overview
Problem
Conventional thermoelectric modules experience poor cooling performance and lead member detachment due to heat transmission issues and external forces, respectively.
Innovation Solution
A thermoelectric module design featuring a pair of support substrates with opposed regions, wiring conductors, thermoelectric elements, and a lead member joined with an electrically conductive material, where the lead member is inclined and coated with a resin to enhance mechanical strength and reduce heat transfer, and a void is provided to manage thermal expansion, thereby improving durability and cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the lead member is positioned in parallel with the principal surface of the support substrate, then the structure is simple, but heat transmission from the lead member to the wiring conductor and support substrate degrades cooling performance
Solution Approach 1:
The lead member is positioned at an inclined angle relative to the principal surface of the support substrate rather than in parallel. This asymmetric positioning reduces the contact area between the lead member and the support substrate, thereby reducing heat transmission from the lead member to the wiring conductor and support substrate, which improves cooling performance.
2Device complexity
If the lead member is positioned in parallel with the principal surface of the support substrate, then the assembly is simple, but the lead member may become detached from the wiring conductor under external forces
Solution Approach 1:
The inclined positioning of the lead member creates a geometric configuration that distributes external forces more effectively across the joining material, reducing the likelihood of detachment from the wiring conductor.
3Reliability
If the lead member is inclined relative to the support substrate, then heat transmission is reduced improving cooling performance, but the joining structure becomes more complex
Solution Approach 1:
An electrically conductive joining material is used to connect the inclined lead member to the wiring conductor on the support substrate. This intermediary component facilitates both electrical connection and mechanical attachment while accommodating the inclined geometry, thereby managing the increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances cooling performance and durability by reducing heat transfer and preventing lead member detachment, maintaining high performance even under external forces and thermal cycles.
Implementation Method 1
a thermoelectric module undergoes a difference in temperature between one principal surface and the other principal surface with the supply of electric power to thermoelectric elements
Implementation Method 2
a thermoelectric module produces electric power via thermoelectric elements upon a difference in temperature between one principal surface of the module and the other principal surface
Data Source
Figure 1~3
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Figure 8~9
AI summary
A thermoelectric module according to the disclosure includes: a pair of support substrates (11, 12) including mutually opposed regions; wiring conductors (21, 22) disposed on opposed one principal surfaces of the pair of support substrates (11, 12), respectively; a plurality of thermoelectric elements (3) disposed between the one principal surfaces of the pair of support substrates (11, 12); a lead member (4) joined to one wiring conductor (21) of the wiring conductors, the one wiring conductor being located on either one support substrate (11) of the pair of support substrates (11, 12); and an electrically conductive joining material (5) which joins the one wiring conductor (21) and the lead member (4) together. The lead member (4) includes a core (41), and a covering layer (42) which covers a rear end-side part of the core (41), and which does not cover a front end-side part of the core (41). A bonding interface between the electrically conductive joining material (5) and the wiring conductor (21) is smaller in width on a side close to the thermoelectric elements (3) than on a side away from the thermoelectric elements (3), as viewed in a section in a direction perpendicular to an axial direction of the lead member (4).