Thermoelectric Module Measurement via Voltage-Temperature Estimation
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Solution Overview
Problem
Current measurement techniques for thermoelectric modules fail to accurately estimate the performance due to unknown interface thermal resistances and atom diffusion issues between components, leading to reduced thermoelectric performance compared to individual pillars.
Innovation Solution
A measurement method and apparatus that apply a current to a thermoelectric module to create a temperature difference between its sides, measuring terminal voltage and temperatures over time to calculate the thermoelectric relationship, allowing estimation of parameters like the Seebeck coefficient and internal resistance, which reflects the module's overall performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If material-oriented measurement techniques are used to measure individual thermoelectric pillars, then the thermoelectric properties of the materials can be measured, but the actual performance of the assembled module cannot be accurately estimated due to unknown interface thermal resistances and atom diffusion problems
Solution Approach 1:
The measurement process is segmented into two distinct phases: a first time period for measuring terminal voltage and temperature difference to calculate thermoelectric parameters (Seebeck coefficient, internal resistance), and a second time period for measuring only temperature difference to calculate thermal conductance. This segmentation allows accurate measurement of module-level performance while keeping the measurement system relatively simple.
Solution Approach 2:
The patent uses terminal voltage measurement as an intermediary to indirectly measure the thermoelectric performance of the module. By measuring the terminal voltage under known current and temperature difference conditions, the system can calculate the Seebeck coefficient and internal resistance without directly measuring the complex internal interfaces and atom diffusion effects that occur during assembly.
2Measurement precision
If interface thermal resistances between thermoelectric pillars, solder layers, and substrate are considered, then the actual temperature difference of pillars is smaller than applied temperature difference, but these interface thermal resistances are unknown and cannot be accurately measured
Solution Approach 1:
The patent extracts and measures the overall thermal conductance of the entire module as a single parameter, rather than attempting to measure the individual interface thermal resistances between pillars, solder layers, and substrate. By measuring the total temperature difference across the module and calculating the overall thermal conductance, the system bypasses the difficulty of detecting and measuring the unknown interface thermal resistances while still obtaining accurate performance data.
3Ease of manufacture
If thermoelectric modules are measured using conventional techniques, then the measurement process is simple, but the actual performance differs from expected performance due to assembly effects
Solution Approach 1:
The measurement process dynamically adapts its measurement strategy based on the state of the system. During the first time period, the system measures terminal voltage, current, and temperature difference to calculate thermoelectric parameters. During the second time period, it measures only temperature difference to calculate thermal conductance. This dynamic measurement approach maintains simplicity while improving reliability by capturing the actual module performance under different operational conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate evaluation of thermoelectric characteristics and efficiency of thermoelectric modules by directly measuring overall parameters such as Seebeck coefficient, internal resistance, and thermal conductance in a short time, overcoming limitations of material-oriented measurement techniques.
Implementation Method 1
a current is supplied to the thermoelectric module to turn both sides of the thermoelectric module respectively into a hot side and a cold side
Implementation Method 2
Regarding thermal conduction between the cold side and the hot side of a thermoelectric module, unknown but obvious interface thermal resistances exist
Implementation Method 3
A plurality of differences between the hot side temperatures and the corresponding cold side temperatures are calculated according to the terminal voltages, the hot side temperatures, and the cold side temperatures measured at the time points during the first time to obtain a thermoelectric relationship between the terminal voltages and the differences
Data Source
AI summary
A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.