Thermoelectric Module Protruding Substrate Junction
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Solution Overview
Problem
Thermoelectric modules face challenges in maintaining the strength of connection between the lead member and support substrates under thermal stress, leading to potential detachment and reduced durability.
Innovation Solution
The thermoelectric module design includes a pair of support substrates with opposed regions, wiring conductors, thermoelectric elements, a lead member joined to one wiring conductor, and a cover material that covers the junction, with protruding portions on the substrates to minimize thermal expansion effects and enhance the area of contact, using materials like copper, silver, and resin to reinforce the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lead member is joined to the wiring conductor on the support substrate, then electrical connection is achieved, but thermal stress causes detachment and reduces reliability
Solution Approach 1:
The patent introduces a protruding portion as an intermediary structural element between the support substrate and the lead member junction. This protruding portion extends from the support substrate toward the lead member, providing additional mechanical support and stress distribution. By positioning the lead member junction on this protruding portion rather than directly on the flat support substrate surface, the design creates a mechanical intermediary that helps distribute thermal stress and prevents direct stress concentration at the wiring conductor connection point, thereby maintaining connection strength under thermal cycling conditions.
2Reliability
If the cover material is applied to protect the junction, then durability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the protective cover material function with the existing support substrate structure by integrating the cover material into the overall module assembly process. The cover material is positioned to overlap the protruding portion and is joined to both the protruding portion and the other support substrate, creating a unified protective structure. This merging approach allows the cover material to serve multiple purposes: protecting the lead member junction, reinforcing the protruding portion structure, and being integrated into the standard module assembly process, thereby improving durability without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the risk of lead member detachment and enhances the durability of the thermoelectric module by minimizing thermal expansion-induced stress and maintaining a strong connection, as demonstrated by a significant reduction in resistance changes and absence of lead member detachment during endurance tests.
Implementation Method 1
In a thermoelectric module, the supply of electric power to a thermoelectric element can produces a difference in temperature between one principal surface and the other principal surface
Implementation Method 2
in a thermoelectric module, upon a difference in temperature between one principal surface and the other principal surface, electric power can be generated by the thermoelectric element
Implementation Method 3
a cover material which covers a junction where the lead member is joined to the one wiring conductor disposed on the one support substrate
Data Source
AI summary
A thermoelectric module includes a pair of support substrates having mutually opposed regions; wiring conductors each disposed on one principal surfaces of the pair of support substrates, the one principal surfaces being opposed to each other; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor disposed on one support substrate; and a cover material which covers a junction where the lead member is joined to the one wiring conductor disposed on the one support substrate. The one support substrate has a first protruding portion including the junction, and the other support substrate has a second protruding portion located so as not to overlap the junction as seen in a direction perpendicular to the one principal surface. The cover material is joined to the first protruding portion and the second protruding portion.