Thermoelectric Module Protrusion Design for Thermal Stress Reduction
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Solution Overview
Problem
Thermoelectric modules face issues with warpage and deformation due to thermal expansion differences between insulating substrates and metal plates, leading to reduced durability and heat dissipation efficiency.
Innovation Solution
The thermoelectric module design includes protrusions on the insulating substrates and metal plates with a non-electrically connected metal pattern on the protrusions, which enhances rigidity and reduces thermal stress, improving durability and heat dissipation by interposing the insulating substrate between the metal plate and the pattern, and optimizing the protrusion shape and placement for better thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If insulating substrates and metal plates are directly attached to each other, then assembly is simplified, but warpage and deformation occur due to thermal expansion differences
Solution Approach 1:
The patent introduces a protrusion structure with a metal pattern on the insulating substrate that acts as an intermediary between the insulating substrate and metal plate. This protrusion with metal pattern reduces thermal stress and prevents warpage while maintaining assembly simplicity, resolving the contradiction between simplified assembly and structural stability.
2Ease of manufacture
If insulating substrates and metal plates are directly attached, then manufacturing process is simplified, but durability decreases due to thermal stress
Solution Approach 1:
The protrusion with metal pattern serves as a stress-relieving intermediary that maintains manufacturing simplicity while significantly improving durability. The metal pattern on the protrusion reduces thermal stress concentration, preventing degradation and improving reliability without complicating the manufacturing process.
3Device complexity
If insulating substrates and metal plates are directly attached, then structure is simplified, but heat dissipation efficiency decreases
Solution Approach 1:
The patent applies local quality by creating a protrusion with metal pattern at specific locations on the insulating substrate. This localized structure optimizes heat dissipation pathways while maintaining overall structural simplicity, improving heat dissipation efficiency without requiring complete structural redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves the durability and heat dissipation properties of the thermoelectric module by reducing warpage, deformation, and thermal stress, as demonstrated by lower maximum temperatures and resistance changes during endurance tests.
Implementation Method 1
when electric power is supplied to a thermoelectric element, a temperature difference can be generated between a pair of support substrates
Implementation Method 2
when a temperature difference is generated between one support substrate and the other support substrate, electric power can be generated by the thermoelectric element
Data Source
AI summary
A thermoelectric module according to the present disclosure includes: a pair of insulating substrates, each insulating substrate including a one main surface in a plan view, and a rectangular facing region of the one main surface, the rectangular facing regions facing each other; wiring conductors located on the one main surfaces of the pair of insulating substrates, respectively; a pair of metal plates located on other main surfaces opposite to the one main surfaces of the pair of insulating substrates, respectively; and a plurality of thermoelectric elements located between the one main surfaces of the pair of insulating substrates. At least one insulating substrate and at least one metal plate include a protrusion protruding from a one side of the rectangular facing region in the plan view, and a metal pattern located on the one main surface of the protrusion, the metal pattern not electrically connected to the wiring conductor.