Thermoelectric Module Series Voltage via Thermal Bridge
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Solution Overview
Problem
Existing thermoelectric modules face challenges in efficiently converting low-temperature thermal energy into electricity due to complex fabrication processes and energy losses from electric contact resistances, particularly when designed as thin layers or plates.
Innovation Solution
A thermoelectric module with a thermoelectric layer of constant thickness, featuring p-type and n-type portions directly coupled without intermediate materials, and thermal resistor elements and bridge elements that enhance heat transfer and reduce thickness while maintaining efficient electric voltage generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electrically insulating material is inserted between p-type and n-type elements to add electric voltages in series, then electric voltage generation is improved, but device complexity and fabrication difficulty increase significantly
Solution Approach 1:
The patent removes the electrically insulating material from the junction surface between p-type and n-type elements. Instead, it uses a separate electrically insulating layer deposited on the back surface of each element. This extraction of the insulating material from the critical junction area eliminates fabrication complexity while maintaining series electrical connection through the thermal conductor bridge that touches only the active surface of each element.
Solution Approach 2:
The patent introduces a thermal conductor bridge as an intermediary element that serves dual purposes: it provides the electrical connection path for series configuration and supports the electrically insulating layer on the back surface. This intermediary structure allows voltage addition in series without requiring insulating material at the junction interface, thus simplifying fabrication.
2Length of moving object
If thermoelectric module thickness is reduced to create compact layer or plate form, then adaptability and compactness are improved, but temperature difference and induced electric voltage decrease
Solution Approach 1:
The patent shifts the voltage generation mechanism from relying on thickness-based temperature difference to relying on series connection of multiple elements. By arranging elements in series through the thermal conductor bridge configuration, the module can achieve high voltage output even with reduced thickness, as the total voltage is the sum of individual element voltages rather than dependent on single-element thickness.
Solution Approach 2:
The patent divides the thermoelectric module into multiple discrete p-type and n-type elements that are independently connected in series. This segmentation allows each element to contribute its own voltage to the total output, enabling compact thin-plate designs to achieve the same or higher voltage output than thicker single-element designs by increasing the number of series-connected segments.
3Temperature
If shunts are used to transport heat between p-type and n-type elements, then heat transfer is improved, but electric contact resistances increase and efficiency decreases
Solution Approach 1:
The patent removes the shunt structure entirely from the element junction area. Instead, it uses the thermal conductor bridge that extends from the back surface to provide thermal coupling without creating additional electrical contact interfaces. This extraction eliminates the electric contact resistances that would be introduced by shunt connections while maintaining effective heat transfer between elements.
Solution Approach 2:
The thermal conductor bridge serves multiple functions: it provides the electrical connection path for series configuration, acts as a thermal conductor for heat transfer between elements, and supports the electrically insulating layer. This multi-functional element eliminates the need for separate shunt structures, reducing electric contact resistances while maintaining heat transfer efficiency.
4Power
If electrically insulating material is inserted along the junction surface to enable series connection, then electric voltage addition is improved, but manufacturing precision requirements increase for thin modules
Solution Approach 1:
The patent removes the electrically insulating material from the junction surface where precision alignment would be critical. By depositing the insulating layer on the back surface instead and using the thermal conductor bridge configuration, the design eliminates the need for precise alignment of insulating material at the element interfaces, significantly reducing manufacturing precision requirements for thin modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for easier fabrication, reduced energy losses, and increased efficiency up to 20% by eliminating the need for insulating materials and shunts, enabling compact, cost-effective thermoelectric converters that can be assembled into large modules.
Implementation Method 1
Thermoelectric converters or thermal conversion modules using the Seebeck effect could be used in order to generate electric energy from such a source of thermal energy
Implementation Method 2
a first thermal bridge element in thermal contact with said lower main surface... said first thermal bridge element is globally able to transfer heat between said thermoelectric layer and the surrounding environment
Implementation Method 3
a first and a second thermal resistor elements in thermal contact with said lower main surface
Implementation Method 4
Using the Peltier effect, thermoelectric converters can also be used to generate heat or coldness from electricity
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
According to a first aspect, the invention relates to a thermoelectric module (10) that comprises a thermoelectric layer (15) comprising one p-type (7p) and one n-type (7n) portions presenting together an upper and a lower main surfaces (11,12). The thermoelectric module (10) further comprises a first and a second thermal resistor elements (1r, 2r), and a first thermal bridge element (3c), between and adjacent to the first and second thermal resistor elements (1r, 2r). The first and second thermal resistor elements (1r, 2r) and the first thermal bridge element (3c) cover the whole lower main surface (12). The p-type (7p) and the n-type (7n) portions are adjacent and directly coupled by an interface (7i). The first thermal bridge element (3c) spans at least over the orthogonal projection of the interface (7i) on the lower main surface (12).