Thermoelectric Module Sealing via Solid-Liquid Interdiffusion Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing high-temperature thermoelectric modules using CoSb3-based skutterudite materials face challenges in achieving a cost-effective and reliable sealing process, particularly due to the materials' sensitivity to oxidation and the need for complex bonding techniques that are not easily scalable.
Innovation Solution
A method involving solid-liquid interdiffusion bonding (SLID) with an adhesion layer/diffusion barrier layer/adhesion layer (ADA) structure is employed to form both electrical contacts and a hermetic seal in a single process step, using metal layers that react to form intermetallic compounds at high temperatures, ensuring strong mechanical and gas-tight bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex bonding techniques are used to achieve reliable sealing, then sealing reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functions (electrical contact formation, thermal connection, and hermetic sealing) into a single integrated metal layer structure that performs all three functions simultaneously, eliminating the need for separate bonding processes for each function
Solution Approach 2:
The metal layer is designed to serve multiple purposes: providing electrical conductivity for current flow, thermal conductivity for heat transfer, and hermetic sealing for oxidation protection, making it a multi-functional component that simplifies the overall device architecture
2Manufacturing precision
If multiple separate processes are used for electrical contact and sealing, then functional precision is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent merges the electrical contact formation and hermetic sealing operations into a single simultaneous process step, where one metal layer formation process accomplishes both functions, thereby doubling manufacturing throughput without sacrificing precision
3Ease of manufacture
If simple sealing methods are used, then manufacturing cost is reduced, but oxidation protection and reliability deteriorate
Solution Approach 1:
The metal layer is designed to simultaneously provide hermetic sealing for oxidation protection and maintain electrical and thermal conductivity, achieving reliable protection without requiring complex multi-layer sealing structures or additional protective coatings
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective, resilient, and hermetically sealed thermoelectric module capable of operating at high temperatures (up to 700-800°C) with improved bonding strength and reduced material degradation, enhancing the module's reliability and efficiency.
Implementation Method 1
solid-liquid interdiffusion bonding (SLID) with an adhesion layer/diffusion barrier layer/adhesion layer (ADA) structure is employed to form both electrical contacts and a hermetic seal
Implementation Method 2
metal layers that react to form intermetallic compounds at high temperatures, ensuring strong mechanical and gas-tight bonding
Implementation Method 3
The Seebeck effect is one of three possible expressions of the thermoelectric effect, namely the direct conversion of thermal energy to electric energy found in some materials when subject to a temperature gradient creating a heat flux through the material
Implementation Method 4
adhesion layer/diffusion barrier layer/adhesion layer (ADA) structure
Implementation Method 5
adhesion layer/diffusion barrier layer/adhesion layer (ADA) structure
Data Source
AI summary
A method for manufacturing a thermoelectric module utilizes solid-liquid interdiffusion bonding for both forming metallization, interconnection and bonding between thermoelectric elements and electric contacts and forming of a hermetic sealing of the thermoelectric module.