Thermoelectric Module Layout for Adjustable Temperature Differential
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Solution Overview
Problem
Thermoelectric devices face limitations in heat conversion efficiency due to a fixed temperature differential between the heat absorption and heat emission portions, restricting their cooling and heating capabilities.
Innovation Solution
A heat conversion device is designed with a thermoelectric module and a heat reduction portion that guides a part of the fluid passing through the first temperature conversion portion to the second, allowing for adjustment of the temperature differential between the heat absorption and heat emission portions, thereby enhancing thermoelectric efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixed temperature differential is maintained between heat absorption and heat emission portions, then the thermoelectric device operates with stable performance, but the cooling and heating temperature range is limited
Solution Approach 1:
The device is divided into multiple independent temperature conversion portions (first and second portions), each capable of operating at different temperatures. This segmentation allows the heat emission portion to be separated from the heat absorption portion, enabling independent temperature control and expanding the overall temperature range while maintaining stable operation of each segment.
Solution Approach 2:
A heat transmission member is introduced as an intermediary to transfer heat between the first and second temperature conversion portions. This mediator allows the system to maintain the required temperature differential for stable thermoelectric operation while enabling the heat emission portion to operate at higher temperatures, thus expanding the cooling and heating temperature range.
2Temperature
If the temperature of the heat emission portion is increased to expand heating capability, then the heating temperature range is improved, but the temperature differential between heat absorption and heat emission portions changes
Solution Approach 1:
By segmenting the temperature conversion into separate portions, the system can increase the temperature of the heat emission portion without affecting the temperature stability of the heat absorption portion. Each segment maintains its optimal operating temperature, preserving the temperature differential stability required for reliable thermoelectric operation.
Solution Approach 2:
The patent introduces a spatial dimension by physically separating the heat absorption and heat emission portions and using a heat transmission member to connect them. This dimensional separation allows independent temperature control of each portion, enabling higher heating temperatures while maintaining the required temperature differential through the transmission path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the temperature differential, enabling more efficient cooling or heating by allowing the temperature of either the heat absorption or heat emission portion to be adjusted, resulting in improved thermoelectric efficiency and increased cooling or heating temperatures.
Implementation Method 1
When a temperature difference is provided between the materials of this PN junction pair, electric power is generated by the Seebeck effect
Implementation Method 2
the thermoelectric element may be used as a temperature controlling device by the Peltier effect in which one material of the PN junction pair is cooled and the other material is heated
Implementation Method 3
a heat reduction portion received in the housing and adopted to guide a part of a fluid passing through the first temperature conversion portion to the second temperature conversion portion
Data Source
AI summary
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.