Thermoelectric Module Wire Connection Holes for Efficiency
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Solution Overview
Problem
Thermoelectric devices face space restrictions due to wire configurations, limiting the area available for thermoelectric devices and thus reducing efficiency.
Innovation Solution
The thermoelectric module incorporates wire connection holes that expose electrodes on both substrates, allowing for direct electrical connection and the use of guide grooves to secure wires, enabling more thermoelectric devices to be placed between substrates and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wires are connected between substrates in a conventional manner, then electrical connection is achieved, but the area available for thermoelectric devices is reduced
Solution Approach 1:
The wire connection structure transitions from a planar arrangement to a three-dimensional configuration by forming wire connection holes that penetrate through the substrate thickness direction. This allows wires to be connected at different vertical levels while maintaining a compact footprint, thereby increasing the area available for thermoelectric devices without compromising connection reliability
Solution Approach 2:
The wire connection holes are formed to penetrate through the substrate, allowing wires to be nested within the substrate structure rather than occupying external space. This nesting approach integrates the electrical connection function within the substrate volume, freeing up surface area for additional thermoelectric devices
2Productivity
If more thermoelectric devices are placed between substrates, then power generation efficiency increases, but wire connection complexity increases
Solution Approach 1:
The substrate is divided into multiple regions with wire connection holes positioned at specific locations to serve different thermoelectric device groups. This segmentation allows independent wiring paths for different device sections, reducing overall connection complexity while enabling higher device density for improved power generation efficiency
Solution Approach 2:
The wire connection holes serve multiple functions: they provide electrical connection pathways, act as structural support elements, and enable thermal management. This multi-functionality reduces the need for additional dedicated connection structures, simplifying the overall wire connection system while supporting increased thermoelectric device placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the number of thermoelectric devices that can be used, improving power generation and heat management efficiency while maintaining stable wire connections and supporting structures.
Implementation Method 1
When a temperature difference occurs between the PN junction pair, power may be generated through the Seebeck effect
Implementation Method 2
Through the Peltier effect, in which one side of the PN junction pair is cooled and the other side is heated
Data Source
AI summary
A thermoelectric module with high efficiency is provided. The thermoelectric module may include a first substrate including a plurality of first electrodes, a second substrate provided opposite the first substrate and including a plurality of second electrodes, a plurality of thermoelectric devices provided between the first substrate and the second substrate and electrically connected to the first electrodes and the second electrodes, and a wire connection hole configured to penetrate through at least one of the first substrate and the second substrate and expose a portion of at least one surface of the first electrodes and the second electrodes.