Thermoelectric Module Wire Connection via Sealing Part Through Hole
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Solution Overview
Problem
Thermoelectric modules face challenges in high-temperature soldering processes that can damage the thermoelectric legs and require manual, time-consuming sealing processes, leading to increased costs and inefficiencies.
Innovation Solution
A thermoelectric module design featuring a wire connection structure with a sealing part that includes a through hole closer to the second substrate, allowing wires to pass through and connect to the thermoelectric element, with connectors and supports that provide electrical conductivity and facilitate easy wire replacement, and a sealing process that simplifies the connection and sealing of electrodes and wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thermoelectric element is heated to soldering temperature (450°C) to connect wires to electrodes, then the wires can be securely connected to the electrodes, but the thermoelectric legs can be damaged by the high temperature
Solution Approach 1:
The patent introduces a separate soldering pad structure that is spatially separated from the thermoelectric legs. The soldering pads are positioned on the substrate surface at locations远离 the thermoelectric leg arrays, allowing soldering operations to be performed on the electrodes without directly heating the thermoelectric legs to damaging temperatures. This segmentation of functional zones resolves the contradiction between achieving reliable wire connections and preventing thermal damage.
Solution Approach 2:
The substrate acts as an intermediary structure that provides dedicated soldering pads for wire attachment. These pads serve as intermediate connection points between the wires and the thermoelectric element's electrical circuit, eliminating the need to heat the fragile thermoelectric legs directly for soldering. The intermediary soldering pads absorb the thermal stress of the soldering process.
2Reliability
If manual sealing process is used to seal between electrodes, wires, and sealing case, then the sealing can be performed, but the time and costs required for the sealing process are large
Solution Approach 1:
The patent designs the sealing structure with pre-defined sealing surfaces and integrated sealing features that are prepared in advance during the module assembly process. The sealing case and electrode arrangements are configured to enable automated sealing operations, eliminating the need for manual sealing operations. This preliminary structuring of sealing interfaces allows for efficient automated sealing processes while maintaining high sealing quality.
3Ease of manufacture
If the through hole in sealing part is disposed closer to the first substrate, then the wire connection is simplified, but the wire part cannot pass through easily and connection reliability decreases
Solution Approach 1:
The patent positions the through-hole in the sealing part closer to the second substrate (opposite side from the first substrate), and inclines the wire part relative to the substrate surface as it passes through the sealing structure. This dimensional adjustment - moving the through-hole location and introducing wire inclination - optimizes the wire passage path, improving both the ease of wire insertion and the reliability of the connection by reducing stress on the wire-solder joint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal conductivity, improves reliability, and simplifies the wire connection and sealing processes, reducing the risk of damage during high-temperature soldering and automating the sealing process, thereby lowering costs and increasing efficiency.
Implementation Method 1
a device using the Seebeck effect, which is a phenomenon in which an electromotive force is generated due to a temperature difference
Implementation Method 2
a device using the Peltier effect, which is a phenomenon in which heat absorption or heat generation by current occurs
Data Source
AI summary
A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a thermoelectric element disposed on the first substrate; a second substrate disposed on the thermoelectric element and having a smaller area than the first substrate; a sealing part disposed on the first substrate and surrounding a side surface of the thermoelectric element; and a wire part connected to the thermoelectric element, drawn out through the sealing part, and supplying power to the thermoelectric element, wherein the sealing part has a through hole through which the wire part passes, and the through hole is disposed closer to the second substrate than the first substrate.