Multi-Layer Thermoelectric Apparatus for Power Generation Efficiency
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Solution Overview
Problem
Current thermoelectric devices have limited power generation efficiency due to low ZT values of thermoelectric materials, especially when dealing with low-temperature waste heat sources, resulting in significant energy loss and restricted cooling and power generation capabilities.
Innovation Solution
A thermoelectric apparatus with a multi-layer structure where p-type and n-type thermoelectric material sets are stacked vertically between substrates with through holes, connected by heat conductors that penetrate these holes, enhancing thermal isolation and maintaining temperature differences across layers to increase power generation capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional single-layer thermoelectric structure is used, then device simplicity is maintained, but power generation efficiency is limited due to insufficient temperature difference maintenance
Solution Approach 1:
The thermoelectric device is divided into multiple layers (first layer with first and second substrates, second layer with third and fourth substrates) with each layer containing thermoelectric material sets. This segmentation allows independent temperature control and heat flow management in each layer, maintaining temperature differences more effectively and improving overall power generation efficiency.
Solution Approach 2:
The patent transitions from a conventional single-layer planar structure to a multi-layer stacked three-dimensional structure. The heat conductors extend vertically through the layers, creating thermal pathways in the vertical dimension while electrical connections remain in the horizontal plane, thereby maintaining temperature differences across multiple dimensions simultaneously.
2Power
If multi-layer structure with heat conductors is implemented, then temperature difference and power generation capacity are enhanced, but manufacturing complexity increases
Solution Approach 1:
The device is fabricated in modular layers that can be independently prepared and then assembled. Each layer contains complete functional units (substrates, thermoelectric materials, electrodes), allowing for standardized manufacturing processes and easier quality control while achieving enhanced power generation capacity.
Solution Approach 2:
The heat conductors are positioned within through-holes of the substrates, with insulating layers nested around the heat conductors. This nested arrangement integrates multiple functions (thermal conduction, electrical insulation, structural support) into a compact configuration that simplifies the overall assembly process despite the multi-layer complexity.
3Power
If thermoelectric materials with low ZT value are used, then material cost and fabrication simplicity are maintained, but cooling capacity and power generation efficiency are restricted
Solution Approach 1:
By dividing the thermoelectric function across multiple layers with optimized heat flow paths, each layer can operate at its optimal temperature range even with moderate ZT materials. The segmented structure prevents thermal short-circuits and maintains larger temperature differences, enabling adequate cooling capacity and power generation without requiring high-ZT materials.
Solution Approach 2:
The patent optimizes thermal and electrical parameters through the multi-layer configuration, including heat conductor cross-sectional areas, insulating layer thicknesses, and layer spacing. These parameter adjustments maximize the temperature difference across each thermoelectric material set, improving efficiency without changing the fundamental material properties.
4Temperature
If heat conductors directly connect substrates without insulation, then thermal conductivity is maximized, but temperature difference between layers is reduced
Solution Approach 1:
Insulating layers are introduced as intermediary elements around the heat conductors. These insulating layers prevent parasitic heat leakage between adjacent thermoelectric material sets while allowing the heat conductors to maintain efficient thermal pathways. This mediator approach preserves temperature differences without significant thermal energy loss.
Solution Approach 2:
The insulating layers are selectively applied only in specific locations where thermal isolation is needed (around heat conductors passing through substrates), while other regions maintain direct thermal pathways. This localized insulation approach optimizes the balance between thermal conductivity and temperature difference maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer structure effectively widens temperature differences between substrates, significantly boosting power generation capacity and efficiency, as demonstrated by thermal transfer simulation results showing increased power output from 10W to 60W under specific temperature conditions.
Implementation Method 1
Based on the properties of thermoelectric conversion, two fields of application, namely heating/cooling capacity and power generation, are created. According to the Seebeck effect, when an n-type semiconductor material and a p-type semiconductor material that are electrically coupled contact different temperatures at the p material connection end and the n material connection end respectively, energy is transferred, and electrical current is generated in the thermocouple.
Implementation Method 2
according to the Peltier effect, when a direct current is applied to a thermoelectric device, heat absorption and heat dissipation will occur to the two ends of the thermoelectric device respectively, and such principle can be used in the cooling or heating technologies.
Implementation Method 3
The first heat conductor penetrates the first through hole of the first high temperature substrate, and two ends of the first heat conductor connect the fourth and second low temperature substrates, respectively. The second heat conductor penetrates the second through hole of the fourth substrate, and two ends of the second heat conductor connect the first and third substrates, respectively.
Data Source
AI summary
A thermoelectric apparatus includes a first and a second assemblies, at least a first and a second heat conductors. The first assembly includes a first and a second substrates, and several first thermoelectric material sets disposed between the first and second substrates. The first substrate has at least a first through hole. The second assembly includes a third and a fourth substrates, and several second thermoelectric material sets disposed between the third and fourth substrates. The fourth substrate has at least a second through hole. Each of the first and second thermoelectric material sets has a p-type and an n-type thermoelectric element. The first and second heat conductors respectively penetrate the first and second through holes. Two ends of the first heat conductor respectively connect the second and fourth substrates, while two ends of the second heat conductor respectively connect the first and third substrates.