Thermoelectric Package Hermetic Frame for Condensation Control
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Solution Overview
Problem
Conventional thermoelectric conversion modules are prone to dew condensation, leading to short circuits and corrosion, especially when the low-temperature substrate becomes excessively cold, which can degrade the performance of thermoelectric elements.
Innovation Solution
A thermoelectric element-containing package with a hermetically sealed space formed by a frame surrounding the thermoelectric elements between two insulating substrates, preventing dew condensation and ensuring the thermoelectric elements operate effectively by maintaining a controlled environment, while also optimizing the arrangement of conductive traces for easier wiring connections and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thermoelectric conversion modules are used for local cooling, then temperature control precision is improved, but dew condensation occurs on the low-temperature substrate causing short circuits and corrosion
Solution Approach 1:
A frame structure is introduced as an intermediary component between the thermoelectric conversion module and the external environment. This frame creates a hermetically sealed enclosure that mediates the interaction between the cold substrate and ambient moisture, preventing dew condensation while maintaining the temperature control function
Solution Approach 2:
The frame encloses the thermoelectric conversion module to create a hermetically sealed environment, effectively isolating the internal components from the external atmospheric moisture. This inert environment prevents dew condensation on the cold substrate while maintaining precise temperature control
2Temperature
If the low-temperature substrate becomes excessively cold, then cooling performance is improved, but dew condensation and moisture absorption occur degrading element performance
Solution Approach 1:
The frame creates a hermetically sealed environment that isolates the thermoelectric conversion module from external atmospheric moisture. This allows the low-temperature substrate to achieve excessively cold temperatures for enhanced cooling performance without causing dew condensation or moisture absorption, as the sealed environment prevents moisture contact
3Ease of operation
If wiring conductors are exposed for external connections, then ease of connection is improved, but susceptibility to dew condensation and corrosion increases
Solution Approach 1:
The frame serves as an intermediary structure that provides designated connection points for wiring conductors while maintaining the hermetically sealed environment. This allows external connections to be made without exposing the internal thermoelectric elements to moisture, preventing dew condensation and corrosion on the wiring conductors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents dew condensation, reduces the risk of short circuits and corrosion, maintains the performance of thermoelectric elements, and allows for more flexible and cost-effective production with reduced substrate size requirements.
Implementation Method 1
a frame that is joined to the first substrate and the second substrate so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements
Implementation Method 2
thermoelectric conversion elements using the Peltier effect
Data Source
AI summary
A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.


