Thermoelectric Cooling Package with Dynamic Chip Thermal Control
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Solution Overview
Problem
The increasing miniaturization of semiconductor packages leads to thermal stress due to heat radiation during operation, which existing technologies fail to manage efficiently without degrading performance.
Innovation Solution
A thermoelectric cooling package utilizing a thermoelectric cooler (TEC) with a temperature sensor to dynamically manage heat by adjusting the direction of heat flow and clock frequency, ensuring efficient heat dissipation without performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are miniaturized to meet user demands for smaller and lighter devices, then device size and weight are reduced, but thermal stress increases due to heat radiation during operation
Solution Approach 1:
The patent implements dynamic thermal management by controlling the operation state of the thermoelectric cooler based on real-time temperature monitoring. The system transitions between active cooling and idle states, and dynamically adjusts clock frequency of the semiconductor chip, creating a dynamic system that adapts to changing thermal conditions rather than using static thermal management approaches
Solution Approach 2:
The patent changes operational parameters including clock frequency and thermoelectric cooler activation state based on temperature conditions. When temperature exceeds thresholds, the system reduces clock frequency and activates cooling; when temperature is acceptable, the system restores full performance. This parameter adjustment resolves the contradiction by allowing the package to operate at different performance levels to manage thermal stress
2Temperature
If a thermoelectric cooler is added to manage heat in miniaturized packages, then thermal stress is reduced, but device complexity increases
Solution Approach 1:
The patent merges the thermoelectric cooler with the semiconductor package substrate, integrating multiple functions into a unified structure. The cooler is mounted on the substrate alongside the semiconductor chip, sharing common thermal and structural pathways. This integration reduces the overall complexity compared to adding separate cooling systems, as the cooler becomes part of the package architecture rather than an external addition
Solution Approach 2:
The patent implements a feedback control system using a temperature sensor that continuously monitors the semiconductor chip temperature and provides feedback to the control logic. This feedback mechanism enables automatic adjustment of cooling activation and clock frequency without requiring complex manual intervention or over-engineered thermal management systems. The feedback loop simplifies the control architecture by using straightforward temperature-threshold-based decision making
3Temperature
If clock frequency is reduced to lower heat generation, then thermal stress decreases, but device performance degrades
Solution Approach 1:
The patent employs periodic action by temporarily reducing clock frequency only when temperature thresholds are exceeded, rather than maintaining reduced frequency continuously. The system monitors temperature in real-time and restores full clock frequency when thermal conditions improve, creating periodic cycles of performance adjustment that minimize the impact on overall productivity while effectively managing thermal stress during critical periods
Solution Approach 2:
The patent takes preliminary action by activating the thermoelectric cooler before temperature reaches critical levels that would require significant performance reduction. The system uses temperature thresholds to trigger cooling activation proactively, allowing the semiconductor chip to maintain higher clock frequencies for longer periods by preventing thermal buildup before it forces performance degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the semiconductor package's temperature within a target range, preventing thermal stress and maintaining performance by actively managing heat through the TEC and clock speed adjustments.
Implementation Method 1
a thermoelectric cooler absorbing heat generated from the semiconductor package to discharge the heat
Implementation Method 2
measuring a temperature of the semiconductor package by the temperature sensor
Data Source
AI summary
Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.