Thermoelectric Plate Cooling for 3D Chip Stack Thermal Management
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Solution Overview
Problem
In 3D chip stacks, the middle chips are not exposed to ambient air, leading to inadequate cooling for high-power components like CPUs, which generate significant heat, necessitating a separate cooling mechanism.
Innovation Solution
A thermoelectric plate is inserted between two chips, separated by coupling layers, with through silicon vias (TSVs) connecting the chips and the thermoelectric plate to a heat sink, allowing for efficient heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple chips are bonded together in a 3D chip stack, then the device becomes more compact and performance increases, but chips in the middle are not exposed to ambient air and cannot be cooled effectively
Solution Approach 1:
A thermoelectric cooling plate is introduced as an intermediary component between chips in the 3D stack. This plate actively removes heat from middle chips that are not exposed to ambient air, enabling effective cooling without increasing device volume. The thermoelectric plate serves as a mediator that transfers heat from the interior chips to the exterior where it can be dissipated.
Solution Approach 2:
The cooling function is segmented by placing separate thermoelectric cooling plates between specific chips in the stack. Rather than relying on passive ambient cooling for all chips, the system divides the cooling task into discrete zones, with active thermoelectric cooling applied only where needed (between middle chips), while exterior chips continue to use passive ambient cooling.
2Temperature
If a thermoelectric cooling plate is inserted between chips, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The thermoelectric cooling plate performs multiple functions simultaneously: it provides active cooling for middle chips, serves as a mechanical spacer to maintain precise chip spacing, and acts as a thermal management interface. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The cooling function is merged with the existing chip stack structure by integrating thermoelectric plates between the chips themselves. Rather than adding a separate cooling system, the thermoelectric plates become part of the stack assembly, sharing the same space and structural role, which minimizes the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermoelectric plate effectively dissipates heat from hotter chips in the middle of the stack to a heat sink, maintaining the temperature gradient for efficient cooling and preventing overheating.
Implementation Method 1
A thermoelectric plate is inserted between two chips, separated by coupling layers, with through silicon vias (TSVs) connecting the chips and the thermoelectric plate to a heat sink, allowing for efficient heat transfer and dissipation
Implementation Method 2
through silicon vias (TSVs) connecting the chips and the thermoelectric plate to a heat sink, allowing for efficient heat transfer and dissipation
Data Source
AI summary
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.