Thermoelectric Polymer Composite Segregated Network
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Solution Overview
Problem
Existing thermoelectric materials face challenges in balancing electrical conductivity, thermal conductivity, and mechanical properties, limiting their efficiency in cooling and power generation, especially at high temperatures and in harsh environments.
Innovation Solution
A thermoelectric composite comprising crosslinked polymers with a segregated network of carbon materials, metals, or their combinations, which enhances electrical and thermal conductivity while providing mechanical resilience, allowing for effective power generation and cooling across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional semiconductors are used for Peltier devices, then cooling efficiency is improved, but mechanical rigidity increases and temperature range is limited
Solution Approach 1:
The patent uses composite materials consisting of conductive polymer matrices combined with filler particles (metallic, ceramic, or carbon-based) to create thermoelectric materials that exhibit both flexible mechanical properties and efficient thermoelectric performance. The composite structure allows the polymer to provide flexibility while the fillers enhance electrical and thermal conductivity for effective cooling.
2Power
If traditional semiconductors are used for Peltier devices, then cooling efficiency is improved, but operating temperature range is limited
Solution Approach 1:
The patent changes the fundamental material parameters by using conductive polymers instead of traditional inorganic semiconductors. These polymers inherently possess broader thermal stability and can operate effectively across a wider temperature range, from sub-ambient to elevated temperatures, while maintaining adequate thermoelectric performance through compositional optimization.
3Ease of operation
If polymer materials are used to improve flexibility, then mechanical pliability is improved, but electrical and thermal conductivity deteriorates
Solution Approach 1:
The patent employs composite materials where conductive polymer matrices are combined with filler particles (metallic, ceramic, or carbon-based) to create thermoelectric materials that exhibit both flexible mechanical properties and efficient thermoelectric performance. The composite structure allows the polymer to provide flexibility while the fillers enhance electrical and thermal conductivity for effective cooling.
Solution Approach 2:
The patent applies local quality by creating segregated networks of conductive fillers within the polymer matrix. This results in regions of high electrical and thermal conductivity localized around the filler particles, while the bulk polymer maintains its flexible, pliable characteristics. The segregated network structure ensures that conductivity is enhanced where needed without compromising overall mechanical flexibility.
4Reliability
If filler materials are added to enhance conductivity, then electrical and thermal conductivity is improved, but material complexity increases
Solution Approach 1:
The patent applies local quality by creating segregated networks of conductive fillers within the polymer matrix. This results in regions of high electrical and thermal conductivity localized around the filler particles, while the bulk polymer maintains its flexible, pliable characteristics. The segregated network structure ensures that conductivity is enhanced where needed without compromising overall mechanical flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite exhibits improved electrical and thermal conductivity, enhanced mechanical properties, and increased efficiency in power generation and cooling, making it suitable for high-temperature applications and harsh environments.
Implementation Method 1
a thermoelectric response in response to application of a voltage difference or temperature difference across the thermoelectric composite
Implementation Method 2
transferring heat between the thermoelectric article and the environment
Implementation Method 3
Certain semiconductors have been used as Peltier devices due to their efficiency in cooling. When used in a Peltier junction, a semiconductor element must be supplied with a voltage in order to actively cool its surrounding environment
Data Source
AI summary
A thermoelectric composite includes a plurality of particles comprising a crosslinked polymer having a heat deflection temperature greater than or equal to 200° F. and a segregated network comprising a first filler material which is disposed between the particles to produce a thermoelectric response in response to application of a voltage difference or temperature difference across the thermoelectric composite. The first filler material includes a carbon material, a metal, a metal disposed on a carbon material, or a combination thereof. A process for preparing a thermoelectric article includes combining a first filler material and a plurality of particles comprising a polymer to form a composition and molding the composition to form a thermoelectric article, wherein the thermoelectric article is configured to produce a thermoelectric response in response to application of a voltage difference or temperature difference across the article.