Thermoelectric Sensor Assembly Heat Dissipation

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Solution Overview

Problem

Existing thermoelectric sensor arrangements face challenges in efficiently generating electrical energy from temperature gradients while being protected from external influences like humidity and vibrations, and in effectively dissipating heat for improved performance.

Innovation Solution

A thermoelectric arrangement that integrates a printed circuit board with a thermoelectric component within a housing, using a thermal conductor device to connect the component to a heat-dissipating structure and a cover, allowing the circuit board to be positioned freely and enhancing heat dissipation through a thermal conductor device, which can be made of materials like copper or stainless steel, and incorporating a potting compound for mechanical stabilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thermoelectric component is integrated within a housing with a printed circuit board, then the component is protected from external influences like humidity and vibrations, but the heat dissipation efficiency may be reduced due to the enclosed structure

Engineering Contradiction:

Improveprotection from external influencesVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The housing is segmented into distinct functional zones: a sealed enclosure for protecting the printed circuit board and thermoelectric component from humidity and vibrations, and a separate heat-dissipating structure with thermal conductors that extends outward to efficiently transfer heat to the environment. This segmentation allows the protective housing not to compromise thermal performance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Thermal conductor devices (such as thermal pads or conductive structures) are introduced as intermediaries between the thermoelectric component and the heat-dissipating structure. These intermediaries bridge the gap between the sealed housing environment and the external heat dissipation path, ensuring efficient heat transfer while maintaining the protective enclosure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If the printed circuit board is fixed within the housing, then mechanical stability is improved, but the ability to optimize thermal pathways and electrical connections is reduced

Engineering Contradiction:

Improvemechanical stabilityVSAvoidenergy generation efficiency

Core Design Contradiction:

Stability of the object's compositionVSProductivity

Solution Approach 1:

The printed circuit board is designed with selective flexibility: it is mechanically stabilized at mounting points to ensure structural integrity, while maintaining degrees of freedom in thermal contact areas. This allows the circuit board to dynamically adjust its position to optimize thermal contact with the thermoelectric component and electrical connections, maximizing energy generation efficiency while preserving mechanical stability.

Inventive Principle:

Principle #15Dynamics

3Loss of energy

If thermal conductor devices are used to connect the thermoelectric component to the heat-dissipating structure, then heat dissipation is improved, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The thermal conductor devices are merged with existing structural elements of the housing or heat-dissipating structure. Rather than being separate, add-on components, the thermal conductors are integrated into the housing design itself (such as using the housing walls as heat sinks or incorporating thermal paths into structural supports), thereby improving heat dissipation without significantly increasing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient energy generation from temperature gradients, protects the components from external influences, and optimizes heat dissipation, allowing for robust and efficient operation of thermoelectric sensors in industrial settings.

Implementation Method 1

The thermoelectric component (20) with a cold side (K1) and a warm side (W1)... efficient energy generation from temperature gradients

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

The at least one thermoelectric component is connected to the heat-dissipating structure (31) on the cold side (K1) with a thermal conductor device (21, 22, 23, 24)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3465781B1Thermoelectric assembly, in particular thermoelectric sensor assembly, and corresponding production method

Publication Date: 2020.03.18 ROBERT BOSCH GMBH

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AI summary

The invention relates to a thermoelectric assembly, in particular a thermoelectric sensor assembly, and a corresponding production method for a thermoelectric assembly. The thermoelectric assembly comprises at least one circuit board, at least one thermoelectric component having a cold side and a hot side, wherein the at least one thermoelectric component is electrically contacted with the at least one circuit board. The thermoelectric assembly also comprises a housing having a cover, wherein the circuit board and the at least one thermoelectric component is arranged in the housing, and the at least one circuit board is arranged in the housing in a largely free-standing manner via the thermal conductor device.