Thermoelectric Assembly Layout for Single-Sided Cooling Mounting

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Solution Overview

Problem

Conventional thermoelectric assemblies (TEAs) require space on both sides of a vertical surface for air exhaust, limiting their mounting flexibility and efficiency in spatially constrained applications.

Innovation Solution

The thermoelectric assembly design features a sloped plane separating the hot and cold sides, allowing for mounting entirely on one side of a surface, with fan sinks and thermoelectric modules in direct thermal contact, and optimized air flow directions to enhance heat transfer and reduce spatial requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional thermoelectric assemblies use a symmetric configuration with fan sinks facing opposite directions, then heat transfer efficiency is maintained, but mounting flexibility is reduced and spatial requirements increase

Engineering Contradiction:
Improvemounting flexibilityVSAvoidspatial requirements
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent applies asymmetry by configuring the first and second fan sinks with non-symmetric orientations. The first fan sink has its air intake direction substantially perpendicular to the mounting surface, while the second fan sink has its air intake direction substantially parallel to the mounting surface. This asymmetric configuration allows the assembly to be mounted on a single side of a surface while maintaining effective heat dissipation from both the hot and cold sides of the thermoelectric modules.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent utilizes dimensional change by orienting the fan sinks in different spatial dimensions relative to the mounting surface. Instead of both fan sinks being oriented in the same dimension (perpendicular to surface), one is oriented perpendicular while the other is oriented parallel, effectively using three-dimensional space to achieve compact single-sided mounting while maintaining cooling performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If thermoelectric assemblies are designed for single-sided mounting, then spatial efficiency is improved, but air flow optimization becomes more difficult

Engineering Contradiction:
Improvespatial efficiencyVSAvoidair flow configuration
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the air flow paths into distinct segments for each fan sink. The first fan sink draws air from a first air source through its own air intake and exhaust paths, while the second fan sink draws air from a second air source through separate air intake and exhaust paths. This segmented approach allows independent optimization of each air flow path, simplifying the overall air flow configuration despite the compact single-sided mounting arrangement.

Inventive Principle:
Principle #1Segmentation

3Speed

If fan sinks are oriented with air intake perpendicular to the mounting surface, then air flow efficiency is maximized, but mounting on vertical surfaces becomes limited

Engineering Contradiction:
Improveair flow efficiencyVSAvoidmounting surface compatibility
Core Design Contradiction:
SpeedVSAdaptability or versatility

Solution Approach 1:

The patent applies asymmetry by configuring the first fan sink with air intake perpendicular to the mounting surface for optimal air flow efficiency, while the second fan sink is configured with air intake parallel to the mounting surface to enable versatility in mounting orientations. This asymmetric dual-configuration allows the assembly to maintain high air flow efficiency while being adaptable to various mounting surfaces including vertical walls, ceilings, and horizontal surfaces.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains efficient heat transfer and cooling performance while allowing for compact mounting on surfaces, suitable for applications where space is limited, such as server racks or rooftop electrical service rooms.

Implementation Method 1

The Peltier effect is an effect in which a heat flux is created between the junction of two different types of materials. Thermoelectric modules (TEMs) are semiconductor devices which use the Peltier effect to transfer heat from one side of the TEM (the 'cold side') to the other side of the TEM (the 'hot side').

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

a fan sink is a heat sink and a fan, each fan comprising a blade, and each heat sink comprising a fin set

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9303902B2Thermoelectric assembly
Publication Date: 2016.04.05 TARK THERMAL SOLUTIONS INC
  • US9303902B2 patent drawing
  • US9303902B2 patent drawing
  • US9303902B2 patent drawing

AI summary

A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where each of the hot side and cold side comprises a fan sink. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. Each of the hot side and cold side has an air intake direction and an exhaust direction.