One-Step Sintering for Thermoelectric Device Electrode Integration
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Solution Overview
Problem
Existing methods for fabricating thermoelectric devices are complex and expose thermoelectric materials to heat and pressure twice, leading to potential degradation and increased costs.
Innovation Solution
A one-step sintering method is developed to connect thermoelectric materials with electrodes, using a separating plate and interlayer materials to form a stacked layer, which is then sintered to create an integral thermoelectric module, simplifying the process and avoiding adverse impacts on the materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-step fabrication method is used to connect electrodes to thermoelectric materials, then reliable electrical connection is achieved, but the process complexity increases and the thermoelectric materials are exposed to heat and pressure multiple times causing degradation
Solution Approach 1:
The patent combines the electrode connection process with the thermoelectric material sintering process into a single integrated step. The electrodes, interlayer materials, and thermoelectric materials are stacked together and sintered simultaneously, eliminating the need for separate connection steps and reducing process complexity while maintaining reliable electrical connection.
Solution Approach 2:
The patent prepares the electrode and interlayer material structures before the sintering process, arranging them in the final stacked configuration. This preliminary arrangement allows the sintering process to simultaneously create both the structural integrity and electrical connections without requiring subsequent processing steps.
2Strength
If traditional multi-step fabrication method is used, then proper material bonding is achieved, but the number of processing steps increases leading to higher costs and longer production time
Solution Approach 1:
The patent merges multiple fabrication operations into a single sintering step that simultaneously bonds electrodes to thermoelectric materials and creates the final structural configuration. This eliminates sequential processing steps, reduces production time, and lowers manufacturing costs while maintaining strong material bonding.
Solution Approach 2:
The sintering process continues uninterrupted to simultaneously achieve multiple objectives: bonding electrodes to thermoelectric materials, densifying the structure, and creating electrical connections. This continuous process eliminates idle time between steps and improves overall fabrication efficiency.
3Stability of the object's composition
If electrodes with matched CTE are selected (such as stainless steel), then thermal expansion compatibility is improved, but electrical conductivity and thermal conductivity decrease compared to metals like Cu and Mo
Solution Approach 1:
The patent employs interlayer materials that act as composite structures between the electrode and thermoelectric material. These interlayer materials can be engineered to provide both CTE matching for thermal stability and adequate electrical/thermal conductivity, resolving the trade-off between expansion compatibility and conduction performance.
Solution Approach 2:
The interlayer material serves as an intermediary between the electrode and thermoelectric material, mediating the thermal expansion mismatch while maintaining electrical and thermal conduction pathways. This intermediate layer buffers the CTE difference without completely blocking conductive properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the fabrication process, reduces costs, and prevents degradation of thermoelectric materials by eliminating the need for a second sintering step under high pressure, resulting in more reliable and efficient thermoelectric devices.
Implementation Method 1
a commonly adopted method for fabricating thermoelectric devices is mainly characterized in steps of: first fabricating (sintering) a bulk element of a thermoelectric device in a die, welding an electrode at a high temperature onto the bulk element
Implementation Method 2
The electricity generation by thermoelectricity is a technique utilizing Seebeck effects in semiconductor materials for realizing direct conversion from heat to electricity
Implementation Method 3
where copper is chosen as the electrode material and the technique of tin soldering is adopted for welding
Data Source
AI summary
A thermoelectric device, a method for fabricating a thermoelectric device and electrode materials applied to the thermoelectric device are provided according to the present invention. The present invention is characterized in arranging thermoelectric material power, interlayer materials and electrode materials in advance according to the structure of thermoelectric device; adopting one-step sintering method to make a process of forming bulked thermoelectric materials and a process of combining with electrodes on the devices to be completed simultaneously; and obtaining a π shape thermoelectric device finally. Electrode materials related to the present invention comprise binary or ternary alloys or composite materials, which comprise at least a first metal selected from Cu, Ag, Al or Au, and a second metal selected from Mo, W, Zr, Ta, Cr, Nb, V or Ti. The present invention simplifies fabricating procedures, reduces the cost and avoids adverse impacts due to exposing related elements to heat and pressure for a second time.