Distributed Thermoelectric String Panels to Limit Heat Backflow
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Solution Overview
Problem
Existing thermoelectric modules face challenges such as high density leading to heat backflow, material limitations for flexible applications, and inefficiencies in cooling and heating due to temperature gradients, which hinder their use in soft materials and energy-efficient local heating and cooling solutions.
Innovation Solution
A thermoelectric string with alternating P-type and N-type elements connected by braided wire, woven into panels to minimize thermal backflow and maximize thermal conduction, eliminating the need for bulky heat sinks and fans, and allowing for flexible, soft panel designs that can be used in various applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thermoelectric elements are densely packed to increase cooling capacity, then the cooling performance is improved, but heat backflow through air conduction increases and performance is limited
Solution Approach 1:
The patent divides the thermoelectric module into discrete elements spaced apart rather than densely packed, with each element having its own heat sink. This segmentation reduces heat backflow between elements while maintaining cooling capacity through distributed thermal management.
Solution Approach 2:
The patent introduces heat sinks as intermediary structures between thermoelectric elements and the ambient environment. These heat sinks act as thermal buffers that dissipate heat locally, reducing the temperature gradient and minimizing heat backflow through the air gap between elements.
2Loss of energy
If thermoelectric elements are spaced out laterally to reduce density, then heat backflow is reduced, but the overall cooling performance is limited
Solution Approach 1:
The patent transitions from a two-dimensional dense array to a three-dimensional distributed configuration with vertical heat sinks. This dimensional change allows elements to be spaced laterally while maintaining thermal performance through extended heat dissipation paths in the vertical dimension.
Solution Approach 2:
The patent changes the thermal management parameters by introducing heat sink geometry (fin structure, surface area) as a variable. By optimizing heat sink parameters rather than element density, the system achieves reduced heat backflow while maintaining cooling capacity.
3Loss of energy
If vacuum enclosures are used to reduce heat backflow, then thermal performance is improved, but manufacturing cost increases and reliability decreases due to leaks and fragility
Solution Approach 1:
The patent extracts the vacuum requirement entirely from the design, replacing it with passive air-gap thermal management. By removing the vacuum enclosure, the system eliminates leak risks and fragility associated with thin-walled vacuum structures while maintaining reduced heat backflow through properly designed heat sinks.
Solution Approach 2:
The patent replaces expensive vacuum enclosures with simple, robust heat sink structures made from common materials like aluminum. These heat sinks are cheaper to manufacture, easier to assemble, and far more reliable while achieving the same thermal management function.
4Stability of the object's composition
If rigid connections are used to connect thermoelectric elements over large distances, then structural integrity is maintained, but elements rupture due to shear stress from thermal expansion
Solution Approach 1:
The patent introduces flexibility into the electrical connections between thermoelectric elements, allowing the connection structure to dynamically accommodate thermal expansion and contraction. This dynamic flexibility prevents shear stress buildup that would cause element rupture while maintaining electrical continuity.
5Ease of manufacture
If high-temperature materials are used to withstand solder reflow oven temperatures, then manufacturing is enabled, but soft materials preferred for body contact applications cannot be used
Solution Approach 1:
The patent segments the manufacturing process into two stages: first assembling the thermoelectric core at high temperature, then adding soft flexible materials in a separate low-temperature process. This segmentation allows both high-temperature manufacturability and low-temperature material versatility.
Solution Approach 2:
The patent performs preliminary assembly of the rigid thermoelectric structure before adding flexible soft materials. This preliminary action at high temperature enables proper soldering and structural formation, while subsequent addition of soft materials preserves their temperature-sensitive properties for body contact applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient local heating and cooling with reduced energy consumption, achieving comparable performance to traditional systems while using less power and eliminating the need for vacuum enclosures and fans, and can generate electricity from heat sources, offering cost-effective and flexible thermoelectric capabilities.
Implementation Method 1
small elements with low resistance allow larger current I to flow before the resistive heat (I2R) generated destroys the thermoelectric cooling (pI1 where p=Peltier coefficient)
Implementation Method 2
the resistive heat (I2R) generated destroys the thermoelectric cooling (pI1 where p=Peltier coefficient)
Implementation Method 3
the backflow of heat conducted and radiated through the air between the elements limits the overall performance
Implementation Method 4
the backflow of heat conducted and radiated through the air between the elements limits the overall performance
Data Source
AI summary
Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.