Thermoelectric String Panels for Passive Heat Dissipation
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Solution Overview
Problem
Existing thermoelectric modules face challenges such as high density leading to heat backflow, thermal expansion issues, and incompatibility with soft materials due to high-temperature assembly processes, limiting their application in local heating and cooling, and renewable power generation technologies face high costs and variable output.
Innovation Solution
A thermoelectric string with alternating P-type and N-type elements connected by braided wire, woven into panels to minimize thermal backflow and leverage natural convection for heat dissipation, eliminating the need for bulky heat sinks and fans, and integrated with heat storage for renewable energy generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermoelectric elements are densely packed to increase cooling capacity, then the cooling performance is improved, but heat backflow through air conduction increases and the module becomes rigid and heavy
Solution Approach 1:
The patent uses flexible circuit boards made of polyimide or polyester instead of rigid PCBs to connect thermoelectric elements. These flexible substrates allow the elements to be spaced further apart while maintaining electrical connections, reducing heat backflow through air conduction while preserving cooling capacity. The flexibility also enables the module to conform to various surfaces including curved ones.
Solution Approach 2:
The patent changes the physical state of the module interior from vacuum (pror art) to atmospheric pressure by using flexible encapsulation. This eliminates the need for expensive vacuum-sealed materials like glass and Kovar while maintaining structural integrity. The flexible circuit boards and encapsulation materials are chosen to have low thermal conductivity to minimize heat backflow.
2Loss of energy
If thermoelectric elements are spaced out to reduce density, then heat backflow is reduced, but the rigid connections cause rupture due to thermal expansion stress
Solution Approach 1:
Flexible circuit boards made of polyimide or polyester are used to connect thermoelectric elements spaced apart on the surface. These flexible substrates can accommodate thermal expansion and contraction without rupturing, unlike rigid PCBs. The flexibility allows the connections to bend and flex as the elements expand and contract with temperature changes, maintaining electrical continuity while preventing structural failure.
Solution Approach 2:
The patent uses composite structures combining flexible polyimide or polyester substrates with conductive traces and thermoelectric elements. This composite approach provides both mechanical flexibility to handle thermal expansion and electrical conductivity to maintain connections. The combination of materials with different thermal and mechanical properties allows the module to withstand thermal cycling without connection failure.
3Ease of manufacture
If traditional high-temperature assembly processes are used, then manufacturing is simplified, but soft materials suitable for body contact cannot be used
Solution Approach 1:
The patent changes the assembly temperature parameter from high-temperature solder reflow (traditional process) to low-temperature bonding suitable for heat-sensitive materials. This allows the use of soft, flexible materials like polyimide, polyester, foam, and fabric that can contact human skin without causing discomfort. The low-temperature assembly process involves bonding thermoelectric elements to these flexible substrates using methods compatible with the materials' thermal limits.
Solution Approach 2:
The patent employs composite material structures where thermoelectric elements are integrated with flexible, soft materials like polyimide, polyester, foam, or fabric. These composite constructions maintain electrical functionality while providing mechanical flexibility and comfort for body contact applications. The material selection prioritizes biocompatibility and flexibility over traditional rigid PCBs.
4Loss of energy
If large heat sinks and fans are used to dissipate heat, then heat dissipation is improved, but the system becomes bulky, heavy, and expensive
Solution Approach 1:
The patent extracts and eliminates the large, bulky heat sinks and active fan systems from traditional thermoelectric modules. Instead, it relies on passive heat dissipation through the flexible substrate and surrounding air convection. This extraction of heavy components dramatically reduces the overall weight and volume of the heat management system while maintaining adequate heat dissipation performance for portable and wearable applications.
Solution Approach 2:
The patent implements self-service heat dissipation where the flexible substrate and surrounding air naturally convect heat away from the thermoelectric elements without requiring active cooling components. The flexible material itself serves as part of the heat dissipation pathway, and natural convection currents in the air provide cooling without fans or pumps. This passive approach eliminates the need for heavy, energy-consuming active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient local heating and cooling with reduced energy consumption, eliminates the need for expensive heat management systems, and provides low-cost, continuous renewable power generation by leveraging natural convection and heat storage.
Implementation Method 1
thermoelectric elements spaced apart by 1-3 mm. Up to 256 such elements are connected in an array... small elements with low resistance allow larger current I to flow before the resistive heat (I2R) generated destroys the thermoelectric cooling (pI1 where p=Peltier coefficient)
Implementation Method 2
the resistive heat (I2R) generated destroys the thermoelectric cooling (pI1 where p=Peltier coefficient)
Implementation Method 3
the rigid connection of elements over large distances causes them to rupture due to sheer stress upon thermal expansion of the hot side relative to the cold side
Implementation Method 4
leverage natural convection for heat dissipation
Data Source
AI summary
Inexpensive, lightweight, flexible heating and cooling panels with highly distributed thermoelectric elements are provided. A thermoelectric “string” is described that may be woven or assembled into a variety of insulating panels such as seat cushions, mattresses, pillows, blankets, ceiling tiles, office partitions, under-desk panels, electronic enclosures, building walls, refrigerator walls, and heat conversion panels. The string contains spaced thermoelectric elements which are thermally and electrically connected to lengths of braided, meshed, stranded, foamed, or otherwise expandable and compressible conductor. The elements and a portion of compacted conductor are mounted within the insulating panel On the outsides of the panel, the conductor is expanded to provide a very large surface area of contact with air or other medium for heat absorption on the cold side and for heat dissipation on the hot side.