Thermoelectric Sub-Cooling for High-Density Processor Heat Removal
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Solution Overview
Problem
Existing cooling solutions for computing devices, such as heat sinks and fluid cooling systems, struggle to effectively dissipate heat due to ambient temperature limitations and insufficient thermal contact between heat-generating components and heat-dissipating components, particularly as processor power and transistor density increase, leading to concentrated heat generation challenges.
Innovation Solution
A component cooling apparatus utilizing multiple heat pipes for heat conduction and thermoelectric coolers (TECs) to split heat loads and provide sub-ambient cooling through controlled airflow, enhancing heat removal efficiency by directing sub-cooled air over critical components like GPUs during high-power applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling solutions (heat sinks, fluid cooling systems) are used, then heat dissipation is achieved through ambient temperature air, but cooling effectiveness is limited by ambient temperature and insufficient thermal contact
Solution Approach 1:
The cooling system is divided into multiple independent cooling zones, each with its own heat pipe and TEC module, allowing targeted sub-ambient cooling of specific high-heat components (CPU, GPU) while maintaining overall system thermal balance
Solution Approach 2:
The invention changes the temperature parameter of the cooling air from ambient temperature to sub-ambient temperature by using TEC modules to actively cool the air before it reaches the heat-generating components, thereby improving cooling effectiveness beyond passive convection limits
2Productivity
If processor power and transistor density are increased, then processing performance is improved, but concentrated heat generation increases making heat removal more difficult
Solution Approach 1:
The cooling system applies different cooling strategies to different locations: TEC modules provide active sub-ambient cooling at specific hot spots (CPU, GPU), while other areas use passive heat dissipation, creating localized cooling quality matched to heat generation density
Solution Approach 2:
The invention adds a new dimension to heat removal by using multiple heat pipes that conduct heat in different spatial directions and through different thermal paths, distributing concentrated heat loads across multiple dimensions rather than relying on single-direction convection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation by distributing heat loads through multiple conduction paths and sub-ambient cooling, maintaining lower component temperatures and improving performance, especially during graphically-intensive tasks.
Implementation Method 1
a thermoelectric cooling device thermally coupled to the component cooling device, the thermoelectric cooling device configured to cool the airflow from a first temperature to a second temperature
Implementation Method 2
A component cooling apparatus utilizing multiple heat pipes for heat conduction
Data Source
AI summary
An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. The thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.