Temperature controlled substrate support assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current plasma processing apparatuses face challenges in achieving uniform temperature control across semiconductor substrates during plasma etching, leading to non-uniform etch rates and selectivities, and limited temperature operating ranges, which hinder the processing of complex material stacks and smaller feature sizes.
Innovation Solution
A temperature-controlled substrate support assembly utilizing thermoelectric modules, arranged in specific patterns to form zones, is integrated into the substrate support assembly, allowing for independent control of temperature across the substrate surface by varying the power and direction of electrical current to the modules, maintaining a desired temperature distribution during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating/cooling methods are used in plasma processing apparatuses, then temperature control is achieved, but uniform spatial temperature control across the substrate is difficult to achieve, leading to non-uniform etch rates
Solution Approach 1:
The substrate support assembly is divided into multiple independently controllable temperature zones, each equipped with its own heating and cooling capabilities. This segmentation allows different regions of the substrate to be controlled at different temperatures or temperature rates, achieving uniform spatial temperature control across the entire substrate surface despite variations in heat generation and dissipation across different zones.
Solution Approach 2:
Each temperature zone is equipped with localized heating elements and cooling channels tailored to the specific thermal requirements of that region. The heating power and cooling flow rates are independently adjusted for each zone based on its local thermal conditions, enabling precise control of temperature uniformity across the substrate surface and consequently achieving uniform etch rates throughout.
2Temperature
If conventional temperature control is used, then basic temperature maintenance is possible, but the operating temperature range is limited, hindering processing of complex material stacks
Solution Approach 1:
The temperature control system transitions from static, fixed-temperature operation to dynamic, adjustable-temperature operation. Each zone can independently vary its heating and cooling rates in real-time, allowing the system to adapt to different material stacks and processing requirements. This dynamic control enables operation across a wide temperature range, accommodating diverse material properties and processing conditions.
Solution Approach 2:
The system enables independent adjustment of temperature parameters (magnitude, rate of change, spatial distribution) for each zone based on the specific requirements of different material stacks. By changing temperature parameters dynamically rather than maintaining a fixed setpoint, the apparatus can process complex materials with varying thermal sensitivities and requirements.
3Measurement precision
If thermoelectric modules are used for temperature control, then precise temperature control and expanded operating range are achieved, but the device complexity increases
Solution Approach 1:
The heating and cooling functions are merged into a single thermoelectric module for each zone, rather than using separate heating elements and cooling systems. The thermoelectric module can operate in heating mode or cooling mode depending on the direction of current flow, reducing the number of separate components and simplifying the overall assembly while maintaining precise temperature control capability.
Solution Approach 2:
Each thermoelectric module serves multiple functions: it can heat, cool, and maintain temperature at different setpoints, and can be independently controlled for different zones. This multi-functionality reduces the need for multiple dedicated systems and simplifies the overall device architecture while achieving precise temperature control across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides precise temperature control, expanding the operating temperature range, achieving uniformity across the substrate surface, and enhancing the yield of devices by maintaining desired processing conditions, even at extreme temperatures, while minimizing thermal non-uniformity and enabling efficient plasma etching.
Implementation Method 1
at least one thermoelectric module is in the cavity in the upper surface of the base plate wherein the at least one thermoelectric module is in thermal contact with the top plate and the base plate
Data Source
AI summary
A baseplate for a temperature controlled substrate support assembly in a vacuum chamber includes a single cavity in an upper surface of the base plate. A cylindrical wall extends upward around an outer perimeter of the base plate to define the cavity. A cover plate arranged on the base plate above the cavity is in thermal contact with the cylindrical wall of the base plate. A plurality of thermoelectric modules is arranged within the cavity in the upper surface of the base plate in thermal contact with the cover plate and the base plate and is sealed from the vacuum chamber and maintained at atmospheric pressure. A plurality of fluid channels is arranged within the base plate below the cavity. A plurality of heat transfer pipes extends downward toward the fluid channels from an upper surface of the base plate within the cavity.