Thermoelectric Module Mounting Substrate With Heat Transfer Through-Holes
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Solution Overview
Problem
Conventional thermoelectric power generation modules mounted on printed substrates face challenges with heat dissipation efficiency due to thermal resistance and difficulty in handling as surface mounting components, especially when integrated with heat-generating devices.
Innovation Solution
A thermoelectric power generation module mounting substrate design featuring a printed substrate with heat transfer through-holes and a thermoelectric power generation module mounted on it, where the substrate is fixed to a housing with screws, enhancing heat transfer by connecting the module directly to a heat source and eliminating the need for additional heat dissipation members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thermoelectric power generation module is mounted on a printed substrate, then the module can be integrated into the substrate, but heat dissipation efficiency is suppressed by thermal resistance of the printed substrate
Solution Approach 1:
The printed substrate is segmented by forming through-holes that penetrate from the first surface to the second surface. These through-holes create separate thermal conduction paths that bypass the thermal resistance of the printed substrate material, allowing heat to be efficiently transferred from the thermoelectric module to the heat dissipation structure mounted on the second surface.
Solution Approach 2:
Conductive members are introduced as intermediary elements that fill or line the through-holes. These conductive members serve as thermal mediators, providing low-resistance thermal conduction paths between the thermoelectric module on the first surface and the heat dissipation structure on the second surface, effectively bridging the thermal resistance gap of the printed substrate.
2Ease of manufacture
If a thermoelectric conversion element is directly bonded onto a printed substrate by solder, then the module can be mounted, but the thermoelectric module itself cannot be handled as a surface mounting component and assembly is difficult
Solution Approach 1:
The design transitions from direct planar bonding to a three-dimensional assembly approach. The thermoelectric module is mounted on the first surface of the printed substrate, while heat dissipation structures are mounted on the second surface through the through-holes. This dimensional separation allows the thermoelectric module to be handled as a standard surface mounting component while maintaining efficient thermal contact through the vertical through-hole paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design promotes efficient heat transfer from the housing to the thermoelectric power generation module, reducing thermal resistance issues and simplifying assembly by integrating the module with the substrate, thus improving power generation efficiency and manufacturing ease.
Implementation Method 1
The thermoelectric power generation module generates power by a Seebeck effect when a temperature difference is generated between the substrates
Implementation Method 2
a printed substrate having a heat transfer through-hole penetrating a first surface and a second surface opposite to the first surface, and being in contact with a housing on the second surface
Data Source
AI summary
A thermoelectric power generation module mounting substrate includes: a printed substrate having a heat transfer through-hole penetrating a first surface and a second surface opposite to the first surface, and being in contact with a housing on the second surface; and a thermoelectric power generation module mounted on the printed substrate in contact with the first surface.