Thermal control device and methods utilizing temperature distribution modeling
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Solution Overview
Problem
Conventional thermal control devices for nucleic acid analysis, such as those used in PCR, face challenges with slow heating and cooling rates, leading to inefficient thermal cycling, especially in high-temperature environments. These devices often rely on fan-based cooling systems that are bulky, power-intensive, and lack precision, resulting in longer cycling times and potential side reactions.
Innovation Solution
A thermal control device that employs a dynamical system architecture with active elements like thermo-electric coolers (TECs) and a sophisticated control unit. This control unit uses state estimation and pole-zero filtering to accurately regulate the reaction-vessel temperature, achieving rapid and precise thermal cycling independent of ambient temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If fan-based cooling systems are used, then cooling capability is provided, but device size and power consumption increase
Solution Approach 1:
The patent replaces the mechanical fan-based cooling system with a solid-state thermoelectric cooler (TEC) that uses the Peltier effect to achieve cooling without moving parts. This substitution eliminates the reliability issues of fan systems (start-up lag, shutdown overlap, mechanical wear) while reducing power consumption and device size.
Solution Approach 2:
The patent changes the fundamental cooling mechanism from convective (fan-based) to thermoelectric (solid-state), utilizing the Peltier effect where electrical current directly creates a temperature difference across the TEC. This parameter change enables precise digital-like control of cooling rates without the lag and overlap problems of mechanical systems.
2Stability of the object's composition
If large thermal mass is used for heating, then heating stability is improved, but heating and cooling rates decrease
Solution Approach 1:
The patent implements dynamic thermal control by using a TEC that can rapidly switch between heating and cooling modes. The system actively adjusts the TEC current in real-time based on feedback from temperature sensors, enabling fast thermal cycling rates (5-10°C/second) while maintaining temperature stability through closed-loop control.
Solution Approach 2:
The patent employs feedback control where temperature sensors continuously monitor the reaction vessel temperature and feed this information to the control system. The controller adjusts the TEC current dynamically to maintain the desired temperature profile, achieving both fast cycling rates and temperature precision through real-time adjustments.
3Speed
If more powerful fans are used to increase cooling rate, then cooling speed improves, but device complexity and space requirements increase
Solution Approach 1:
The patent replaces the complex mechanical fan system with a solid-state thermoelectric cooler that has no moving parts. This substitution dramatically simplifies the system while achieving superior cooling rates and precision. The TEC controls cooling by adjusting electrical current, eliminating the need for mechanical components, bearings, and complex control logic required for fan systems.
4Ease of manufacture
If conventional thermal control devices are used, then implementation is simple, but thermal cycling precision and speed are insufficient
Solution Approach 1:
The patent implements feedback control where temperature sensors continuously monitor the reaction vessel temperature and feed this information to the control system. The controller adjusts the TEC current dynamically to maintain the desired temperature profile, achieving both fast cycling rates and temperature precision through real-time adjustments.
Solution Approach 2:
The system uses the temperature feedback to automatically adjust its own operation without external intervention. The control algorithm processes the temperature data and autonomously modulates the TEC current to maintain precise thermal cycling, making the system self-regulating and highly precise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables faster and more efficient thermal cycling, reducing cycle times and minimizing side reactions. It provides precise temperature control, even in high-temperature environments, and is designed to be compact and energy-efficient, suitable for portable diagnostic devices.
Implementation Method 1
at least one active element that generates a heat-flux... In some embodiments, each thermal control device includes more than one active element, such as two TECs that are positioned to be bilaterally applied to opposing sides of the reaction-vessel
Implementation Method 2
one or more temperature sensors that are positioned and configured to measure the ambient temperature indicative of the thermal operating environment around the reaction-vessel and/or the temperature of a portion of the at least one active element
Data Source
AI summary
Thermal control devices and methods to provide improved control, speed and efficiency in temperature cycling are provided herein. Such thermal control device and methods can include one or more active elements, such a thermoelectric cooler device, that is controlled by an algorithm that regulates a temperature distribution of an adjacent reaction-vessel according to a temperature distribution command trajectory and estimated reaction-vessel temperature distribution. Some embodiments include two active elements that are bilaterally applied to opposing sides of the reaction-vessel. In some embodiments, the estimated reaction-vessel temperature is determined based on a state of power electronics of the element and a temperature output of one or more sensors of a portion of the element and/or an ambient environment of the reaction-vessel. Methods of calibration of such systems utilizing a thermal calibrator as a proxy for the reaction-vessel are also provided herein.