Thermoelectric Thermal Via Structure for Uniform Package Cooling
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Solution Overview
Problem
Semiconductor package structures face challenges in heat dissipation due to their small size and high power density, leading to non-uniform temperature distribution, which can cause reliability issues such as crack formation and delamination, and existing solutions like fans and thermal interface materials do not adequately address these problems.
Innovation Solution
The implementation of a thermal conduction unit comprising a conductive via and a periphery conductor with thermoelectric materials, where the periphery conductor encloses the via and an isolation material is interposed between them, forming a thermal-to-electrical energy conversion apparatus and an electrical-to-thermal energy conversion apparatus to efficiently dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the semiconductor package structure is made small to reduce footprint, then the area is reduced, but heat dissipation becomes difficult and temperature distribution becomes non-uniform
Solution Approach 1:
The patent segments the heat dissipation function by introducing multiple thermal conduction units (including conductive vias and periphery conductors) distributed across the package structure. This segmentation allows heat to be dissipated through multiple parallel pathways, improving temperature uniformity while maintaining a compact footprint.
Solution Approach 2:
The patent applies local quality by placing thermal conduction units at specific locations throughout the package structure, including both central and peripheral regions. This localized arrangement optimizes heat dissipation where needed most, addressing non-uniform temperature distribution without increasing overall package size.
2Productivity
If high-speed data transmission is implemented to increase data capacity, then the data capacity is improved, but heat generation increases significantly
Solution Approach 1:
The patent converts the harmful heat generated by high-speed data transmission into a manageable thermal conduction problem. By incorporating thermoelectric materials in the thermal conduction units, the patent utilizes the temperature gradients created by heat generation to produce electrical energy through the Seebeck effect, thereby converting waste heat into useful energy while improving data transmission capability.
3Loss of energy
If conventional heat dissipation methods like fans and thermal interface materials are used, then some heat dissipation is achieved, but they do not adequately address non-uniform temperature distribution and reliability issues
Solution Approach 1:
The patent replaces mechanical heat dissipation systems (such as fans) with solid-state thermal conduction units integrated into the package structure. This substitution eliminates moving parts and mechanical complexity while achieving superior heat dissipation and temperature uniformity, thereby improving reliability.
Solution Approach 2:
The patent employs composite materials by combining thermoelectric materials with conventional thermal conduction structures. This composite approach enables both efficient heat dissipation and electrical energy generation from temperature gradients, addressing both heat management and reliability concerns simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables highly efficient heat dissipation, reduces the size of the electronic module, and improves the working life and reliability of semiconductor package structures by maintaining a uniform temperature distribution and preventing warpage and delamination.
Implementation Method 1
The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material.
Data Source
AI summary
A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.