Thermoformable Film Packaging Sealing with Low Conductivity Molds
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Solution Overview
Problem
Current thermoformable film packaging systems for portioned products face challenges with inefficient heat transfer during sealing, leading to poor bonding and increased costs due to the need for silicon washers and complex water supply systems, especially when packaging water-soluble films.
Innovation Solution
A system utilizing molds made of low thermal conductivity materials like PEEK or PET and sealing tools coated with high thermal conductivity silicone-copper layers for effective heat transfer, eliminating the need for silicon washers and simplifying the sealing process by using a modular conveyor with thermoforming and sealing tools that translate back and forth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon washers are used to improve sealing and adhesion, then sealing quality improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the silicon washer component entirely from the sealing system. Instead of using a separate washer element, the sealing function is integrated directly into the mold cavity surface, which is coated with a release agent layer that provides both release functionality and sealing capability in a single integrated structure.
Solution Approach 2:
The patent combines the release agent coating and sealing function into a single integrated layer on the mold cavity surface. The release agent layer serves dual purposes: preventing adhesion of the packaged product to the mold during demolding, and providing sealing between the mold and packaging material, eliminating the need for separate silicon washer components.
2Reliability
If water supply systems are used to assist sealing, then sealing effectiveness improves, but device complexity and operational cost increase
Solution Approach 1:
The patent employs a release agent coating on the mold cavity that performs sealing through its inherent material properties rather than requiring external water supply systems. The release agent layer creates a controlled interface that enables sealing through its chemical and physical characteristics, making the system self-sufficient without complex hydraulic or water delivery infrastructure.
Solution Approach 2:
The patent replaces mechanical water supply systems with a chemical solution approach. Instead of using water delivery mechanisms, pumps, and control systems, the sealing function is achieved through the release agent coating's material properties, substituting a complex mechanical system with a simpler chemical-based solution.
3Temperature
If high thermal conductivity materials are used for molds, then heat transfer during sealing improves, but heat loss to the mold increases
Solution Approach 1:
The patent applies different thermal properties to different regions of the sealing system. The sealing area of the mold is coated with a release agent layer that has specific thermal characteristics optimized for heat transfer to the packaging material, while the bulk mold structure maintains its inherent thermal properties. This localized differentiation allows efficient heat transfer where needed without excessive heat loss throughout the entire mold.
Solution Approach 2:
The patent creates a composite sealing interface by combining the mold surface with a release agent coating layer. This composite structure integrates the mold's thermal conductivity with the release agent's thermal properties, creating an optimized thermal pathway for sealing while preventing excessive heat loss to the mold bulk, thereby improving overall heat transfer efficiency during the sealing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and high-quality sealing of thermoformable films, reducing operational costs and simplifying maintenance, while ensuring effective heat transfer and bonding without the need for silicon washers or complex water systems.
Implementation Method 1
The circumferential washer is made of a material having a very low coefficient of friction
Implementation Method 2
a heating element arranged above the mold and adapted to heat the sealing tool
Implementation Method 3
Two channels 2 are provided for supplying vacuum and compressed air
Data Source
Figure 1a~1h
Figure 2a~2i
Figure 3a~3h
AI summary
A system for thermoformable film packaging of portioned products, the system including a mold assembly comprising at least one mold (17) the shape of which corresponds to the shape of the portioned products, at least one thermoforming tool (18) and at least one welding tool (19), the system being adapted to package the portioned products (24) in a lower thermoformable film (23) which is shaped in the mold by means of the thermoforming tool (18) and welded with an upper thermoformable film (25) by means of the sealing tool (19), wherein each of the tools (18, 19) is translated back and forth between its position of pressure against the mold assembly and its position spaced from the mold assembly, wherein each form (17) is made of a material having thermal conductivity of at most 0,5 W/(m·K), and in that each sealing tool (19) is provided with an elastic heat conductive layer (21) contacting the sealed film, the layer (21) being made of a material having thermal conductivity of at least 3 W/(m·K). A modular conveyor (38) for thermoformable film packaging of portioned products comprising a plurality of modules (26, 27, 28) forming an endless chain, the endless chain being movable along the conveyor and having an upper part (38a) and a lower part (38b), equipped with the system according to the invention.