Thermoformed Enclosure Assembly for RF Transparency

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Solution Overview

Problem

The existing methods for manufacturing enclosures for telecommunications equipment, particularly those requiring specific sizes and RF transparency, face challenges in producing overlapping joints or transitions using thermoforming, which are difficult to achieve without intricate detailing.

Innovation Solution

A method involving thermoforming of shells and bodies from moldable materials like plastic or fiberglass, with secure assembly to create a weather-resistant enclosure that meets DoITT specifications, using vacuum forming and securing mechanisms like adhesive and fastening systems to ensure RF signal transmission and weather-tight sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If thermoforming is used to manufacture enclosures, then manufacturing cost is reduced and production efficiency is improved, but producing overlapping joints or transitions becomes difficult without intricate detailing

Engineering Contradiction:
Improveproduction efficiencyVSAvoidoverlapping joint precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The enclosure is divided into multiple separate thermoformed components (front wall, rear wall, side walls, base) that are assembled together using overlapping joints. This segmentation allows each component to be thermoformed independently with standard detailing, while the overall enclosure achieves the required precision through the assembly of these segmented parts with overlapping joints.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If injection molding is used to manufacture enclosures, then manufacturing precision is improved, but manufacturing cost increases significantly

Engineering Contradiction:
Improveenclosure precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The enclosure is segmented into multiple thermoformed components that are assembled together. This approach achieves the required manufacturing precision through the assembly process and overlapping joints rather than requiring a single complex injection molded part, thereby significantly reducing manufacturing cost while maintaining precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses thermoformed plastic shells and panels to create the enclosure components. Thermoforming allows for cost-effective production of precise plastic parts with complex geometries, including overlapping joints and transitions, by using heated and formed thin plastic sheets, achieving both precision and cost-effectiveness.

Inventive Principle:
Principle #30Flexible shells and thin films

3Strength

If the enclosure is made as a single integrated part, then structural strength is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveenclosure strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The enclosure is divided into multiple components (front wall, rear wall, side walls, base) that are assembled together. The overlapping joints and fastening systems create strong structural connections between these segmented parts, achieving sufficient enclosure strength without requiring a single complex integrated part, thereby reducing manufacturing complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple separately manufactured components are merged together through overlapping joints and fastening systems to form the complete enclosure. This merging process creates a structurally strong assembly that meets strength requirements while keeping individual components simple and easy to manufacture.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively produces enclosures that meet specific size and shape requirements, provide RF transparency, and ensure weather resistance, facilitating the installation and maintenance of telecommunications equipment while adhering to DoITT standards.

Implementation Method 1

thermoforming a first shell from a moldable material, thermoforming a second shell from the moldable material, thermoforming a first body from the moldable material, and thermoforming a second body from the moldable material

Methodology Applied
Scientific EffectThermoforming: Phase Change

Implementation Method 2

vacuum forming a first shell from a plastic material, vacuum forming a second shell from the plastic material, vacuum forming a first body from the plastic material, and vacuum forming a second body from the plastic material

Methodology Applied
Scientific EffectVacuum forming: Vacuum

Data Source

PatentUS10112339B2Method for making an enclosure
Publication Date: 2018.10.30 EXTENET SYSTEMS INC
  • US10112339B2 patent drawing
  • US10112339B2 patent drawing
  • US10112339B2 patent drawing

AI summary

An enclosure for housing electrical equipment is disclosed. The enclosure is produced by thermoforming four separate pieces or bodies together to form the top and bottom of the enclosure. The enclosure is made of a moldable material, such as plastic or fiberglass.