Thermoformed Hull Encapsulated Hearing Device
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Solution Overview
Problem
Extended wear hearing devices face challenges in maintaining minimal size, consistent placement, protection from moisture and cerumen, and biocompatibility, while minimizing rework and nickel release in a moist environment.
Innovation Solution
A hearing device with a single-piece thermoformed hull and an encapsulated electronics module, where the module is positioned consistently due to the hull's rigidity, using a tube for alignment and sealing, and a vent tube for pressure equalization, all while employing a biocompatible and moisture-resistant material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible silicone rubber mold is used for encapsulation, then the device can accommodate size variations, but the positioning of the electronics module becomes inconsistent and adhesive distribution becomes uneven
Solution Approach 1:
The patent uses a flexible silicone rubber mold for encapsulation, which allows the mold to accommodate size variations in the hearing device components while maintaining consistent adhesive distribution through its material properties
Solution Approach 2:
The patent changes the physical state and properties of the adhesive by controlling curing parameters (temperature, time, humidity) to ensure consistent adhesive distribution and bonding even when component dimensions vary within acceptable tolerances
2Reliability
If the hull wall thickness is increased to improve moisture barrier, then protection from moisture and cerumen improves, but the outer dimensions of the device increase
Solution Approach 1:
The patent uses a composite structure combining a thin-walled hull (20-100 μm) made of moisture-resistant material with an encapsulating adhesive layer, creating a multi-layer barrier system that provides superior moisture and cerumen protection without increasing overall device dimensions
Solution Approach 2:
The patent employs a thin-film encapsulation approach using flexible adhesive materials that conform to the hull interior, providing effective moisture and cerumen barrier protection while maintaining minimal wall thickness and device compactness
3Reliability
If the electronics module is fully encapsulated to protect from moisture, then protection from moisture improves, but sound transmission is blocked
Solution Approach 1:
The patent extracts the sound transmission function from the encapsulation system by providing dedicated sound inlets and outlets that remain open and unencapsulated, allowing sound waves to pass through while the rest of the electronics module remains protected by the adhesive encapsulation
Solution Approach 2:
The patent applies different properties to different parts of the device: the encapsulating adhesive is applied selectively to protect electronic components while leaving sound transmission pathways open, creating local variations in protection and permeability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved moisture protection, reduced rework, consistent fit, and enhanced biocompatibility, ensuring reliable operation and comfort over extended wear periods.
Implementation Method 1
The entire electronics module with the exception of at least part of the sound inlet (to allow sound to enter) and at least part of the sound outlet (to allow sound to exit) is encapsulated into the hull by an adhesive
Implementation Method 2
the thermoformed hull itself provides a significantly better barrier to moisture than the encapsulation adhesive alone used in a silicone form
Implementation Method 3
it acts as a seal between the electronics module and the hull, preventing the encapsulation adhesive from entering the sound opening
Data Source
AI summary
The present invention relates to an encapulated hearing device (50), e.g. for long-term wear, in which an electronics module (10) is encapsulated into a thermoformed hull (30) by means of an appropriate adhesive (41). This thermoformed hull (30) acts as an improved barrier between the electronics module (10) and the environment of the inner ear, reducing the risk of moisture reaching electrical components.