Thermoformed Plastic Cover for Electronics Protection
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Solution Overview
Problem
The existing manufacturing processes for multilayer electronic structures face challenges in protecting electronic components from cracking or breaking during the lamination process, due to difficulties in regulating pressure and temperature, leading to increased manufacturing costs.
Innovation Solution
A multilayer structure comprising a flexible substrate film with electronic components and conductive traces, covered with a thermoformed plastic material that defines a protective cap shape, optionally transparent or translucent, to secure the components from environmental factors and facilitate light emission or detection, using methods like printed electronics and injection molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lamination is performed with high pressure and temperature to ensure proper attachment of the top layer, then the attachment quality improves, but the electronic components may crack or break
Solution Approach 1:
The patent applies preliminary action by placing a protective layer over the electronic components before the lamination process. This protective layer is positioned in advance to prevent damage during subsequent high-pressure and high-temperature lamination, allowing the top layer to be properly attached without compromising component integrity.
Solution Approach 2:
The patent implements beforehand cushioning by introducing a protective layer that acts as a cushion between the electronic components and the lamination pressure. This cushioning layer absorbs and distributes the pressure, preventing direct transmission of harmful forces to the components while still allowing effective lamination bonding.
2Strength
If lamination pressure and temperature are reduced to protect electronic components, then component integrity is maintained, but the top layer attachment becomes insufficient
Solution Approach 1:
The protective layer is placed in advance over the electronic components before lamination. This preliminary positioning enables the lamination process to proceed with optimized pressure and temperature settings that ensure proper top layer attachment, while the pre-positioned protective layer simultaneously safeguards component integrity.
Solution Approach 2:
The protective layer serves as an intermediary element that mediates between the lamination process and the electronic components. It allows the transmission of necessary heat and pressure for effective bonding while filtering out damaging concentrated forces, thus enabling both good attachment and component protection.
3Strength
If a rigid top layer is used to provide structural support, then mechanical strength improves, but the risk of component cracking during manufacturing increases
Solution Approach 1:
The protective layer is placed in advance over the electronic components before the rigid top layer is applied. This preliminary protective covering allows the rigid top layer to provide necessary structural support without directly contacting and potentially cracking the components during manufacturing processes.
Solution Approach 2:
The protective layer acts as a cushioning barrier positioned beforehand between the rigid top layer and the electronic components. This cushioning effect distributes mechanical stresses and prevents concentration of forces that could lead to component cracking, while still allowing the rigid top layer to provide overall structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects electronic components from damage and environmental conditions, ensuring proper attachment and reducing manufacturing costs by using thermoformed plastic covers that securely encapsulate the components without cracking, while allowing for efficient light interaction.
Implementation Method 1
at least one cover placed at least partially on top of the at least one electronic component for protecting and securing the electronic components when the thermoplastic material is molded
Data Source
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Figure 4A~4C
Figure 5
AI summary
A multilayer structure for an electronic device comprising a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said sub-strate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.