Thermoforming Recesses for Embedded Electronics Protection

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Solution Overview

Problem

Current thermoforming processes compromise or destroy electronics mounted on plastic sheets during the forming process due to heat and mechanical stress, as they are not adapted to handle sheet-borne electronics.

Innovation Solution

The development of a thermoforming apparatus that includes recesses in the heating platens and form cores to create air gaps around electronic components, preventing direct contact and excessive heating, which allows for the formation of three-dimensional plastic parts with embedded electronics without damaging them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If conventional thermoforming processes are used to form plastic sheets, then the plastic sheet can be deformed into three-dimensional shapes, but the electronics mounted on the sheet are compromised or destroyed due to heat and mechanical stress

Engineering Contradiction:
Improvethree-dimensional formVSAvoidelectronics functionality
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The heating platen is divided into multiple heating zones, with specific regions providing reduced or no heating corresponding to the locations of electronic components. This segmentation allows different portions of the plastic sheet to be heated to different degrees, enabling 3D forming while protecting electronics from excessive heat

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heating platen are designed with different heating characteristics - areas with electronics receive minimal or no heat while other areas receive full heating for forming. This local differentiation of heating quality enables simultaneous achievement of 3D shaping and electronics protection

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If heat is applied to the plastic sheet to enable forming, then the sheet becomes deformable, but the electronics on the sheet are damaged by excessive heating

Engineering Contradiction:
ImproveformabilityVSAvoidheat damage to electronics
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The heating platen is divided into multiple heating zones, with specific regions providing reduced or no heating corresponding to the locations of electronic components. This segmentation allows different portions of the plastic sheet to be heated to different degrees, enabling 3D forming while protecting electronics from excessive heat

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A blanket with relief areas is introduced as an intermediary between the heating platen and the plastic sheet. The blanket provides uniform heating to the sheet while the relief areas prevent direct heat transfer to electronic components, acting as a thermal mediator

Inventive Principle:
Principle #24Intermediary (Mediator)

3Shape

If mechanical pressure is applied to the sheet during forming, then the sheet conforms to the form core, but the electronics are crushed or compromised

Engineering Contradiction:
Improveconformance to form coreVSAvoidelectronics structural integrity
Core Design Contradiction:
ShapeVSStrength

Solution Approach 1:

The form core is designed with recesses or relief areas corresponding to the locations of electronic components. This segmentation of the form core structure allows mechanical pressure to be applied to the plastic sheet for conformance while preventing direct compression of the electronics

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The form core incorporates pre-designed recesses and relief areas that provide cushioning protection for electronic components before the forming process begins. This beforehand cushioning prevents crushing during the mechanical forming operation

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the successful thermoforming of plastic sheets with embedded electronics by minimizing heat transfer and mechanical stress on the components, ensuring their functionality is maintained throughout the forming process.

Implementation Method 1

Heat from a plate can be uniformly transferred by conduction (often through contact) to the sheet material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Air pressure is used to position the sheet material adjacent the surface

Methodology Applied
Scientific EffectPressure: Pressure Increase

Data Source

PatentUS11685102B2Three dimensional thermoforming and lamination
Publication Date: 2023.06.27 HY TECH WORLDWIDE INC
  • US11685102B2 patent drawing
  • US11685102B2 patent drawing
  • US11685102B2 patent drawing

AI summary

A system and method for forming plastic sheet into a three-dimensional shape. The plastic sheet may include one or more sheet-mounted components, such as electronics, that must be shielded from excessive heat, pressure, and/or crushing when the formation of the sheet occurs. A recess will be formed to protect against directly contacting sheet-mounted component. The recess may be aligned along the heating plate and/or the form core and/or along a protective blanket which may be set over (and under) sheet prior to heating/forming. The sheet is registered (with or without a blanket) onto a base plate, and preferably over a form core. The sheet is then raised to contact with a heating plate, and then placed downward over the (optionally heated) form core. Recess(es) align in locations corresponding to mounted component to protect same.