Thermomesh Sensor for Heat Source Localization and Peak Temperature

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Solution Overview

Problem

Existing thermal imaging techniques struggle to accurately and efficiently locate and measure heat sources, especially in confined or harsh environments, due to high manufacturing costs and low temporal resolution of thermocouples or resistance temperature detectors, and the limitations of infrared cameras.

Innovation Solution

A thermomesh sensor composed of interwoven Chromel® and Alumel® thermocouple wires forms a mesh configuration, generating thermoelectric electromotive forces to determine temperature differences, combined with machine learning algorithms for precise heat source localization and peak temperature estimation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If infrared thermal imaging techniques are used for heat source localization, then high spatial and temporal resolution is achieved, but the device complexity and cost increase significantly

Engineering Contradiction:
Improveheat source localization accuracyVSAvoidsensor system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the measurement task into multiple discrete thermocouple nodes arranged in a grid pattern across the surface. Each node independently measures temperature at its location, and the collective data from segmented measurements enables heat source localization through computational processing, avoiding the need for a single complex infrared imaging system

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the optical/mechanical infrared imaging system with an electrical measurement system using thermocouples and data processing. Instead of using infrared radiation detection mechanics, the system uses electrical temperature sensing at discrete points combined with mathematical algorithms to achieve heat source localization

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If arrays of thermocouples or RTDs are used for thermal imaging, then manufacturing cost is reduced, but temporal resolution deteriorates

Engineering Contradiction:
Improvesensor manufacturing costVSAvoidtemporal resolution
Core Design Contradiction:
Ease of manufactureVSSpeed

Solution Approach 1:

The patent implements a dynamic measurement system where only the thermocouple nodes near the heat source are actively measured and processed in real-time. The system dynamically adjusts which nodes are monitored based on heat flow patterns and temperature gradients, enabling high temporal resolution without requiring all nodes to be simultaneously active at high speed

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent uses partial action by measuring temperature at selected thermocouple nodes rather than continuously monitoring all nodes at maximum speed. The system activates and processes only the necessary subset of sensors based on the specific measurement requirements and heat source location, achieving sufficient temporal resolution with reduced computational and measurement burden

Inventive Principle:
Principle #16Partial or excessive action

3Adaptability or versatility

If conventional thermal imaging methods are used in confined environments, then measurement capability is limited, but the ability to measure in harsh environments deteriorates

Engineering Contradiction:
Improvemeasurement environment flexibilityVSAvoidmeasurement reliability in harsh conditions
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent creates a universal measurement system using thermocouples that can be deployed in multiple environments (confined spaces, harsh conditions, internal structures) where infrared cameras cannot operate. The same basic thermocouple node architecture serves multiple measurement purposes across different application scenarios, providing both adaptability and reliability

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses thermocouple nodes as intermediary sensors that can be physically embedded or attached to surfaces in environments where direct infrared measurement is impossible. These intermediary points serve as reliable measurement interfaces between the harsh measurement environment and the data processing system, enabling indirect but accurate heat source detection

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermomesh sensor achieves high spatial and temporal resolution for heat source localization and peak temperature estimation, reducing costs and improving accuracy through an ill-posed underdetermined linear system solved by deep learning and artificial neural networks.

Implementation Method 1

Each node of the plurality of nodes defines a measurement point of the heat source sensor, with a difference in thermoelectric electromotive forces between two nodes of the plurality of nodes indicative of a temperature difference between the two nodes

Methodology Applied
Scientific EffectThermoelectric effect: Seebeck Effect

Data Source

PatentUS12406178B2Apparatus and method for heat source localization and peak temperature estimation
Publication Date: 2025.09.02 WESTERN NEW ENGLAND UNIVERSITY
  • US12406178B2 patent drawing
  • US12406178B2 patent drawing
  • US12406178B2 patent drawing

AI summary

A heat source sensor includes a plurality of first wires extending in a first direction, a plurality of second wires extending in a second direction different from the first direction and crossing the plurality of first wires, and a plurality of nodes. Each node is defined at a crossing of a first wire of the plurality of first wires and a second wire of the plurality of second wires. The first wire is secured to the second wire at the node. Each node of the plurality of nodes defines a measurement point of the heat source sensor, with a difference in thermoelectric electromotive forces between two nodes of the plurality of nodes indicative of a temperature difference between the two nodes.