Thermometer Sensor Head Vacuum-Filled Ceramic for Fast Response
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Solution Overview
Problem
Thermometers with embedded and/or encapsulated temperature sensors have slower response times and lower mechanical stability compared to those with soldered sensors, and are not suitable for measuring high temperatures.
Innovation Solution
A method involving vacuumizing the internal volume of a sensor head before filling it with a dense fill material, such as powdered aluminum oxide or ceramic potting material, to enhance thermal conductivity and response times, and optionally filling with a high thermal conductivity gas like helium to further improve performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the temperature sensor is embedded and/or encapsulated in ceramic powders or ceramic potting material, then mechanical stability is improved, but response time deteriorates
Solution Approach 1:
The patent changes the physical state parameters of the fill material by producing a vacuum in the internal volume before filling, which increases the density of the ceramic powder or potting material. This parameter change (increased density) improves thermal conductivity while maintaining mechanical stability, thereby resolving the contradiction between response time and mechanical stability
Solution Approach 2:
The patent uses a vacuum environment (inert atmosphere) during the filling process to prevent air pockets and ensure complete filling of the sensor head. This creates optimal contact between the fill material and sensor elements, improving thermal coupling without compromising mechanical stability
2Loss of time
If the temperature sensor is soldered to the sensor head, then response time is improved, but mechanical stability deteriorates
Solution Approach 1:
The patent introduces a fill material (ceramic powder or ceramic potting material) as an intermediary substance between the sensor elements and the sensor head. This intermediary provides both mechanical support (stability) and thermal coupling (response time), resolving the contradiction between the two requirements
3Ease of manufacture
If the fill material is introduced without vacuumizing, then manufacturing simplicity is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent performs a preliminary action (vacuumizing the internal volume) before introducing the fill material. This preliminary step removes air pockets and ensures complete filling, which significantly improves thermal conductivity while adding minimal complexity to the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves the response time of thermometers to temperature changes while maintaining mechanical stability, making them suitable for higher temperature measurements.
Implementation Method 1
producing a vacuum in an internal volume of the sensor head
Implementation Method 2
introducing at least one fill material into at least a portion of the internal volume of the sensor head
Implementation Method 3
optionally filling with a high thermal conductivity gas like helium to further improve performance
Data Source
AI summary
The present disclosure relates to a method for manufacturing an apparatus for determining and/or monitoring temperature of a medium comprising method steps as follows: arranging a sensor element in a sensor head, producing a vacuum in an internal volume of the sensor head, introducing at least one fill material into at least a portion of the internal volume of the sensor head, and closing the sensor head. The present invention relates, moreover, to a correspondingly manufactured apparatus.