Thermopile Sensor for High Temperature Thermal Measurements

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Solution Overview

Problem

Existing temperature and heat flux measurement instruments are not suitable for high-temperature environments due to their limited durability and reliability, making it challenging to accurately monitor and analyze thermal data in applications like rocket engines and gas turbines.

Innovation Solution

A thermopile sensor with a uniform substrate and refractory metal thermopile junctions, connected in series, along with a thermocouple component, is designed to operate effectively in high-temperature environments by utilizing a substrate with a varying elevation and an anti-oxidation layer, allowing for accurate temperature and heat flux measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional temperature sensors (thermocouples, resistance temperature detectors, thermistors) are used in high temperature environments, then measurement capability is provided, but reliability and durability deteriorate due to oxidation and material degradation

Engineering Contradiction:
Improvesensor durabilityVSAvoidoperating temperature limit
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The sensor employs a composite structure combining refractory metal strips (tungsten, molybdenum) with a ceramic substrate (sapphire, silicon carbide). This composite design enables the sensor to withstand temperatures exceeding 1000°C while maintaining structural integrity and measurement accuracy, directly resolving the contradiction between reliability and temperature limit.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent employs thin-film deposited refractory metal strips that can be rapidly replaced if degraded. The thin-film nature allows for cost-effective batch fabrication and replacement, maintaining system reliability without requiring long-lived individual sensor components.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Adaptability or versatility

If existing instrumentation options are used, then temperature measurement is achieved, but adaptability to harsh high temperature environments deteriorates

Engineering Contradiction:
Improveenvironmental adaptabilityVSAvoidmeasurement accuracy
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The sensor implements local quality through differentiated substrate sections: a first section with elevated thermopile junctions for heat flux measurement and a second section at lower elevation for temperature reference. This local differentiation enables simultaneous measurement of multiple thermal parameters in harsh environments, enhancing both adaptability and reliability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the physical state and properties of materials to adapt to high temperature environments. Refractory metals maintain structural stability at temperatures where conventional metals would oxidize or deform, while ceramic substrates provide thermal stability. This parameter change enables operation in previously inaccessible temperature regimes.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If thermopile junctions are placed on a flat substrate surface, then manufacturing is simplified, but measurement precision deteriorates due to insufficient thermal gradient detection

Engineering Contradiction:
Improvethermal gradient detection accuracyVSAvoidsubstrate structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional flat substrate to a three-dimensional structure with elevated sections. The thermopile junctions are positioned on a first section that rises vertically from the substrate, creating a stepped configuration. This dimensional change enhances thermal gradient detection by positioning junctions in regions of higher thermal stress while maintaining manufacturability through standard deposition techniques.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor provides reliable and accurate measurements of temperature and heat flux up to 1000°C, with continuous operation demonstrated for over ten hours, and offers a cost-effective, minimally invasive solution for high-temperature applications.

Implementation Method 1

a first strip of a first conductive material, extending from the first section to the second section, and a second strip of a second conductive material, forming an electrical junction with the first strip on the second section

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

a third strip of a third conductive material connecting with a fourth strip of a fourth conductive material on the first surface of the substrate to form an electrical junction

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Data Source

PatentUS11644364B1High temperature thermal sensors
Publication Date: 2023.05.09 LOUISIANA TECH RES CORP
  • US11644364B1 patent drawing
  • US11644364B1 patent drawing
  • US11644364B1 patent drawing

AI summary

A thermopile sensor including a uniform substrate having a first surface with a first section and a second section at an elevation varying relative to the first section by between about 5 micrometers and about 500 micrometers. The sensor further includes a plurality of thermopile junctions, with each junction having (i) a first strip of a first conductive material, extending from the first section to the second section, (ii) a second strip of a second conductive material, forming an electrical junction with the first strip on the second section and extending to the first section, and (iii) with the thermopile junctions being connected in series. A first contact pad on the substrate is connected to an initial thermopile junction and a second contact pad on the substrate is connected to a last thermopile junction, with conductors connecting to the first and second contact pads and extending off of the substrate.