Thermoplastic Adhesive Layer Uniformity on Large Substrates
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Solution Overview
Problem
The existing press working method for bonding a substrate and a support plate via an adhesive struggles to maintain uniformity of the adhesive layer as the substrate size increases, particularly at the end portions, leading to difficulties in uniform bonding.
Innovation Solution
A bonding method and apparatus that involves forming a thermoplastic adhesive layer on the substrate or support plate, heating it, and then pressing the substrate and support plate together using a bonding apparatus with a heat source and press unit, ensuring uniform bonding by improving the thermal fluidity of the adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a press working method is used for bonding a substrate and a support plate via an adhesive, then bonding can be achieved, but as the substrate size increases, the adhesive layer cannot maintain uniformity, particularly at the end portions
Solution Approach 1:
The adhesive layer is heated before the pressing operation to improve its thermal fluidity in advance. This preliminary heating action ensures that when pressing occurs, the adhesive can flow uniformly across the entire substrate surface including end portions, resolving the uniformity issue that arises with larger substrate sizes.
Solution Approach 2:
The temperature of the adhesive layer is changed by applying heat before pressing. This parameter change (temperature increase) improves the thermal fluidity of the adhesive, allowing it to maintain uniformity across larger substrate areas and ensuring consistent bonding quality at all positions including end portions.
2Manufacturing precision
If the adhesive layer is heated before pressing, then uniform bonding is achieved across the entire substrate including end portions, but additional processing steps are required
Solution Approach 1:
The heating unit and pressing unit are integrated into a single bonding apparatus. The heating unit is positioned to heat the adhesive layer from below, and the pressing unit applies pressure from above, allowing both heating and pressing operations to be performed simultaneously or in sequence within the same device, thereby reducing overall process complexity.
3Manufacturing precision
If the adhesive layer is heated before pressing, then uniform bonding is achieved, but additional processing time is required
Solution Approach 1:
The heating and pressing operations are performed in continuous sequence without interruption. The adhesive layer is heated first, then immediately pressed while maintaining the elevated temperature, ensuring the bonding process continues without stopping. This continuous action maximizes the effectiveness of the heating step and ensures uniform bonding is achieved efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for uniform bonding of substrates and support plates by enhancing the thermal fluidity of the adhesive layer, preventing bonding failures and ensuring consistent adhesion across larger substrates.
Implementation Method 1
a heating unit for heating the adhesive layer that is formed on the substrate or the support plate
Implementation Method 2
a bonding unit for pressing the substrate and the support plate to each other via the heated adhesive layer, and bonding the substrate and the support plate
Data Source
AI summary
A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.