Thermoplastic Adhesive Transfer via Antiadhesive Peripheral Zones
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Solution Overview
Problem
The conventional method of depositing an adhesive layer of thermoplastic polymers on substrates for temporary bonding in electronic component manufacturing faces challenges such as heat tolerance issues, wettability problems, material incompatibility, and unsuitable topography, making it difficult to apply the adhesive layer directly on substrates with existing components.
Innovation Solution
A method involving the transfer of an adhesive layer from one substrate to another by depositing an antiadhesive peripheral layer on the first substrate, an adhesive layer on the central zone, and an antiadhesive layer on the second substrate, followed by thermocompression to bond them, allowing the adhesive layer to be transferred and easily detached, adhering only to the periphery of the second substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an adhesive layer is deposited directly on the substrate of interest by spin coating and heat treatment, then the adhesive layer can be formed, but the electronic components or substrate cannot withstand the heat treatment required
Solution Approach 1:
The process is segmented into two independent stages: first, the adhesive layer is formed on a temporary substrate that can withstand high temperatures; second, the completed adhesive layer is transferred to the substrate of interest. This segmentation allows the heat treatment to occur during adhesive formation without exposing the electronic components to damaging temperatures.
Solution Approach 2:
The adhesive layer is preliminarily formed on the temporary substrate before the substrate of interest is introduced. The temporary substrate serves as a protective carrier that enables the adhesive to be cured and stabilized before being brought into contact with the temperature-sensitive electronic components.
2Manufacturing precision
If a liquid formulation is deposited on the substrate, then an adhesive layer can be formed, but the top face has insufficient wettability to ensure homogeneous and covering deposition
Solution Approach 1:
The temporary substrate is designed with inherent properties that facilitate the deposition process. Its surface characteristics promote uniform wetting and homogeneous distribution of the liquid adhesive formulation, eliminating the need for complex surface treatment of the substrate of interest.
3Reliability
If the adhesive layer is transferred from the first substrate to the second substrate, then the adhesive layer can be applied without heat treatment on the substrate of interest, but the transfer process requires additional steps and materials
Solution Approach 1:
The temporary substrate acts as an intermediary carrier that enables indirect application of the adhesive layer. This mediator allows the adhesive to be formed and transferred without direct contact between the heat treatment process and the temperature-sensitive substrate of interest, protecting the electronic components while maintaining process efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively transfers and detaches the adhesive layer, ensuring it adheres only to the periphery of the second substrate, enabling easy reapplication and facilitating the handling of substrates without damaging the top face, thus overcoming the limitations of conventional deposition methods.
Implementation Method 1
a step of bonding the first substrate and the second substrate consisting of thermocompressing the top face of the first substrate onto the top face of the second substrate
Implementation Method 2
an antiadhesive layer on a first substrate, this layer being deposited on the periphery of the top face of said substrate
Data Source
AI summary
A method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate including: depositing an antiadhesive layer on a first substrate, this layer being deposited on the periphery of the top face of said substrate, referred to as peripheral layer, thus providing on said top face a zone devoid of said layer, referred to as central zone; depositing an adhesive layer of thermoplastic polymer(s) on said central zone; depositing an antiadhesive layer on a second substrate, this layer being deposited on the top face of the second substrate excluding its periphery, said periphery being thus devoid of said antiadhesive layer; bonding the first substrate and the second substrate consisting of thermocompressing the top face of the first substrate onto the top face of the second substrate; removing the first substrate, whereby the second substrate remains, of which the top face is coated by the adhesive layer of thermoplastic polymer(s).