Thermoplastic Adhesive for High-Temperature Wafer Securing
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Solution Overview
Problem
Conventional adhesives used for temporarily securing semiconductor wafers, such as waxy adhesives and heat-sensitive adhesives, fail to maintain adhesiveness in high-temperature environments and can cause stress-induced breakage during debonding, while also having poor flexibility and washability issues.
Innovation Solution
A thermoplastic adhesive comprising a multivalent vinyl ether compound, a compound with hydroxy and carboxy groups, and a thermoplastic resin, which forms a cross-linked structure with a high softening point, maintaining adhesiveness in high-temperature environments and allowing stress-free debonding and easy removal of adhesive residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a waxy adhesive is used for temporarily securing wafers, then the adhesive can be easily applied and removed, but the adhesive has a low softening point and flows and moves in high-temperature processes
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesive by incorporating a multivalent vinyl ether compound and a compound with hydroxy and carboxy groups that form cross-linked structures, fundamentally altering the thermal properties to achieve a high softening point while maintaining operational ease
Solution Approach 2:
The invention creates a composite adhesive system combining multiple chemical components (multivalent vinyl ether compound, compound with hydroxy and carboxy groups, and thermoplastic resin) to achieve both high temperature resistance and ease of operation, resolving the contradiction between softening point and ease of application
2Reliability
If a heat-sensitive adhesive including a pressure-sensitive adhesive and a side-chain crystalline polymer is used, then the adhesive can maintain adhesiveness at room temperature, but the adhesive flows and moves in high-temperature processes
Solution Approach 1:
The invention changes the thermal stability parameters by forming a cross-linked polymer structure through the reaction of multivalent vinyl ether compound with compound containing hydroxy and carboxy groups, raising the softening point to above 100°C and preventing flow at high temperatures while maintaining room temperature adhesiveness
3Ease of repair
If an adhesive is cured and contracted by ultraviolet rays to debond from the wafer, then the adhesive can be removed from the wafer, but the wafer is susceptible to breakage due to stress upon debonding
Solution Approach 1:
The invention replaces the mechanical stress-based debonding method (ultraviolet curing and contraction) with a thermal-based removal mechanism, where the adhesive is softened by heating to a temperature above its softening point, allowing stress-free removal and preventing wafer breakage
4Reliability
If the adhesive is formulated to have high adhesiveness in high-temperature environment, then the adhesive can secure the adherend during processing, but the solidified product has poor flexibility and may cause spontaneous debonding or cracking
Solution Approach 1:
The invention formulates a composite adhesive containing a multivalent vinyl ether compound, a compound with hydroxy and carboxy groups, and a thermoplastic resin, where the cross-linked structure provides high-temperature stability while the thermoplastic resin component maintains flexibility, preventing spontaneous debonding and cracking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive provides excellent flexibility and adhesiveness, preventing spontaneous debonding and cracking due to temperature changes, and allows for easy removal of residue, making it suitable for securing fragile semiconductor wafers during processing.
Implementation Method 1
when heated, undergoes polymerization of the multivalent vinyl ether compound, through acetal bonding, with the compound containing two or more groups selected from hydroxy and carboxy
Implementation Method 2
polymerization of the multivalent vinyl ether compound, through acetal bonding, with the compound containing two or more groups selected from hydroxy and carboxy
Implementation Method 3
the adhesive can be debonded (removed) from the adherend without applying stress to the adherend, by heating at a temperature equal to or higher than the softening point of the polymer, because a solidified product of the adhesive is abruptly softened or liquefied upon the heating
Data Source
AI summary
Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.