Thermoplastic Resin Bonding System With Rotating Jig
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Solution Overview
Problem
Existing bonding technologies for resin materials, particularly those with 3-dimensional configurations, face limitations in productivity due to unidirectional bonding capabilities, poor tool accessibility, and high costs associated with adhesive agents and equipment, making it difficult to efficiently bond large-sized resin parts for automobiles.
Innovation Solution
A bonding system comprising a supporting jig with multiple mounting surfaces, an articulated robot, and a control unit that controls the bonding device for improved accessibility and temperature adjustment, enabling multidirectional bonding and efficient welding of thermoplastic resin materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If adhesive agents are used to bond large-sized resin parts, then bonding of complex shapes is enabled, but productivity decreases due to high costs and long curing time
Solution Approach 1:
The patent replaces chemical bonding (adhesive agents requiring curing time) with mechanical-thermal bonding (welding process). The bonding device applies heat and pressure to melt and fuse thermoplastic resin parts directly, eliminating the need for adhesive agents and curing等待时间，从而解决了对复杂形状部件的粘结能力与生产率之间的矛盾
Solution Approach 2:
The patent changes the bonding parameters from chemical-based (adhesive curing) to physical-thermal-based (heat and pressure). By controlling temperature and pressure parameters during the welding process, the system achieves rapid bonding of complex-shaped parts without sacrificing versatility, directly addressing the productivity issue while maintaining adaptability
2Adaptability or versatility
If C-gun type bonding device is used for two-sided access, then bonding capability is provided, but tool accessibility is poor and capital investment is high
Solution Approach 1:
Instead of using a C-gun device that requires two-sided access, the patent inverts the approach by using a single-sided bonding device that accesses parts from one side only. The supporting jig holds parts in a configuration that allows the bonding device to reach bonding surfaces without requiring complex articulated mechanisms, thereby reducing device complexity while maintaining bonding capability
Solution Approach 2:
The patent extracts the essential bonding function from the complex C-gun system. By using a simpler bonding device attached to a standard articulated robot, combined with a specially designed supporting jig, the system achieves the same bonding capability without the need for expensive, complex two-sided access equipment
3Ease of manufacture
If unidirectional bonding method is used, then planar shapes can be bonded, but multidirectional bonding of 3-dimensional configurations is not possible
Solution Approach 1:
The patent introduces dynamics to the bonding system through a rotatable supporting jig that can change orientation. The jig can rotate to present different bonding surfaces to the bonding device, enabling multidirectional bonding of 3-dimensional parts while maintaining the simplicity of the bonding process. This dynamic adjustment allows the system to handle complex geometries without complicating the fundamental bonding operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances productivity by allowing for efficient bonding of complex shapes, reducing capital investment and processing time, while improving weld quality and accessibility to previously challenging areas like 'deep belly' portions, and enabling faster operation with a lighter articulated robot.
Implementation Method 1
a bonding device that sandwiches the bonding substrates between the bonding device and the mounting surface and that welds the bonding substrates
Implementation Method 2
a bonding device that sandwiches the bonding substrates between the bonding device and the mounting surface and that welds the bonding substrates
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.