Thermoplastic Alignment Element for Camera Sensor Board
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Solution Overview
Problem
Current camera alignment techniques, both active and passive, face challenges such as complex processes, the need for clean room environments, and high mechanical tolerances, especially with high-pixel image sensors, which complicate the alignment of optics units and sensor boards while being prone to dust contamination.
Innovation Solution
A camera arrangement utilizing a thermoplastic alignment element fixed to the optics unit, a biasing element to abut the sensor board, and a heating element to heat the thermoplastic to its glass transition temperature for alignment, allowing for simpler assembly and post-assembly adjustments without requiring a clean room environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment with UV curing glue is used, then alignment precision is improved, but device complexity and process complexity increase
Solution Approach 1:
The patent extracts the alignment function from the complex UV glue application process by introducing a dedicated alignment element with positioning features that mechanically define the relationship between optics unit and sensor board, eliminating the need for UV curing glue and associated complexity
Solution Approach 2:
The alignment element serves as an intermediary component between the optics unit and sensor board, providing mechanical positioning and alignment without requiring complex adhesive processes. The alignment element with its positioning features mediates the alignment function separately from the bonding function
2Ease of manufacture
If passive alignment is used, then assembly process is simplified, but manufacturing precision deteriorates
Solution Approach 1:
The alignment element is pre-configured with positioning features during manufacturing that define the precise alignment relationship. This preliminary action embeds the alignment precision requirements into the component design itself, allowing simple assembly without compromising precision
Solution Approach 2:
The patent changes the physical state of the alignment element by heating it to the glass transition temperature of the thermoplastic material, making it deformable for alignment adjustment, then cooling it to lock the position. This parameter change enables both ease of assembly and high precision
3Adaptability or versatility
If alignment is performed outside sealed space, then alignment adjustability is improved, but dust contamination increases
Solution Approach 1:
The patent segments the alignment process into two distinct phases: a sealed assembly phase where components are brought together in a controlled environment, and an adjustable alignment phase where the heating element allows post-assembly alignment adjustments. This segmentation enables dust protection while maintaining alignment adjustability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the alignment process, reduces mechanical tolerance requirements, and minimizes dust exposure by enabling alignment within a sealed space, resulting in a less complex and cost-effective mounting process while maintaining the ability for post-assembly adjustments.
Implementation Method 1
a heating element which is arranged in the contact area, and which upon activation is configured to transfer heat to the alignment element
Implementation Method 2
heating the alignment element at least partly to a temperature of at least the glass transition temperature of the thermoplastic material, for enabling alignment
Implementation Method 3
a biasing element which is configured to bias the alignment element into abutment with a contact area of the sensor board
Data Source
AI summary
A camera arrangement comprises an optics unit and a sensor board with an image sensor attached to a first surface of the sensor board facing the optics unit. An alignment element formed by a thermoplastic material is fixedly attached to the optics unit, and a biasing element is configured to bias the alignment element into abutment with a contact area of the sensor board. A heating element is arranged in the contact area. Upon activation the heating element is configured to transfer heat to the alignment element, such that the alignment element is heated at least partly to a temperature of at least the glass transition temperature of the thermoplastic material, for enabling alignment of the sensor board relative the optics unit.